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Other articles related with "TN30":
3691
Wang Yanhao, Deng Erping, Wang Zuoyi, Li Daohui, Huang Yongzhang
The Influence Mechanism of Humidity on the Chip Solder Layer Thermal Resistance of Power Semiconductor Devices
Transactions of China Electrotechnical Society 2024 Vol.39 (12): 3691-3704 [
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55
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128
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4947
Wang Laili, Zhao Cheng, Zhang Tongyu, Yan Feifei
Review of Packaging Technology for Silicon Carbide Power Modules
Transactions of China Electrotechnical Society 2023 Vol.38 (18): 4947-4962 [
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848
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14261 KB] (
529
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2850
Peng Cheng, Li Xuebao, Fan Jiayu, Zhao Zhibin, Cui Xiang
Effect of Stray Inductance Difference on Transient Current Distribution in Press-Pack IGBT Devices
Transactions of China Electrotechnical Society 2023 Vol.38 (11): 2850-2860 [
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133
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9629 KB] (
297
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4911
Shang Hai, Liang Lin, Wang Yijian, Yang Yingjie
Weighted Optimization Design and Experimental Study of 6.5kV SiC MOSFET Module
Transactions of China Electrotechnical Society 2022 Vol.37 (19): 4911-4922 [
Abstract
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147
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27145 KB] (
541
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4664
Zhao Fangwei, Li Yan, Wei Chao, Zhang Nan, Zheng Yanxuan
Accurate Measurement of Dynamic on-Resistance of GaN Devices and Affecting Factor Analysis
Transactions of China Electrotechnical Society 2022 Vol.37 (18): 4664-4675 [
Abstract
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765
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1 KB] [
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2952 KB] (
774
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2471
Peng Cheng, Li Xuebao, Zhang Guanrou, Zhao Zhibin, Cui Xiang
Design and Implementation of an Experimental Platform for Dynamic Characteristics of Press-Pack IGBT Chip
Transactions of China Electrotechnical Society 2021 Vol.36 (12): 2471-2481 [
Abstract
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260
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1 KB] [
PDF
10628 KB] (
689
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3408
Zhou Jing, Kang Shengyang, Li Hui, Yao Ran, Li Jinyuan
Simulation of Influence of Unbalanced Clamping Force on Electro-Thermal Characteristics of Press-Pack IGBT Devices
Transactions of China Electrotechnical Society 2019 Vol.34 (16): 3408-3415 [
Abstract
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221
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1 KB] [
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57699 KB] (
814
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717
Wang Xuemei, Zhang Bo, Wu Haiping
A Review of Fatigue Mechanism of Power Devices Based on Physics-of-Failure
Transactions of China Electrotechnical Society 2019 Vol.34 (4): 717-727 [
Abstract
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315
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1 KB] [
PDF
49712 KB] (
654
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4277
Zhang Jingwei, Deng Erping, Zhao Zhibin, Li Jinyuan, Huang Yongzhang
Simulation on Fatigue Failure of Single IGBT Chip Module of Press-Pack IGBTs
Transactions of China Electrotechnical Society 2018 Vol.33 (18): 4277-4285 [
Abstract
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277
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1 KB] [
PDF
47388 KB] (
652
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4286
Wang Yueyue, Chen Minyou, Lai Wei, Chen Yigao, Luo Dan
Healthy Condition Assessment on MOSFETs Based on External Characteristic Parameters and Adaptive Neuro-Fuzzy Inference System
Transactions of China Electrotechnical Society 2018 Vol.33 (18): 4286-4294 [
Abstract
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270
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1 KB] [
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46425 KB] (
873
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1
Liu Binli, Luo Yifei, Xiao Fei, Wang Bo
IGBT Thermal Model for Thermal Simulation of Device to System
Transactions of China Electrotechnical Society 2017 Vol.32 (13): 1-13 [
Abstract
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556
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1 KB] [
PDF
48586 KB] (
986
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201
Deng Erping, Zhao Zhibin, Zhang Peng, Huang Yongzhang, Lin Zhongkang
Clamping Force Distribution within Press Pack IGBTs
Transactions of China Electrotechnical Society 2017 Vol.32 (6): 201-208 [
Abstract
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459
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1 KB] [
PDF
507 KB] (
1684
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63
He Junwei,Chen Sizhe,Ren Na,Bai Song,Tao Yonghong,Liu Ao,Sheng Kuang
Fabrication and Testing of 4 500 V SiC SBD and JFET Power Modules
Transactions of China Electrotechnical Society 2015 Vol.30 (17): 63-69 [
Abstract
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419
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2166 KB] (
972
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136
Zhang Jianxin, Niu Pingjuan, Wu Zhigang, Wang Jingxiang, Li Hongyue
Two-Objective Optimization of Heat Sink Cooling Performance for High-Power LED Application
Transactions of China Electrotechnical Society 2014 Vol.29 (4): 136-141 [
Abstract
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696
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1 KB] [
PDF
593 KB] (
1912
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242
Zheng Libing, Han Li, Liu Jun, Wen Xuhui
Investigation of the Temperature Character of IGBT Failure Mode Based on 3D Thermal-Electro Coupling FEM
Transactions of China Electrotechnical Society 2011 Vol.26 (7): 242-246 [
Abstract
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518
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0 KB] [
PDF
555 KB] (
2248
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100
Chen Mingbao
Research on Theoretic Model ＆ Its Package Types of the Bidirectional IGBT
Transactions of China Electrotechnical Society 2009 Vol.24 (10): 100-105 [
Abstract
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356
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1 KB] [
PDF
489 KB] (
2338
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43
Wang Laili, Zhao Cheng, Zhang Tongyu, Yan Feifei
Review of Packaging Technology for Silicon Carbide Power Modules
Transactions of China Electrotechnical Society 0 Vol. (): 43-43 [
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97
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1 KB] [
PDF
4353 KB] (
691
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230611
Wang Laili, Zhao Cheng, Zhang Tongyu, YanFeifei
Review of Packaging and Integration Technology in Silicon Carbide Power modules
Transactions of China Electrotechnical Society 0 Vol. (): 230611-230611 [
Abstract
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38
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4311 KB] (
291
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