内部压力不均对压接式IGBT器件电热特性的影响分析

doi:10.19595/j.cnki.1000-6753.tces.180769

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Abstract Press-pack IGBT (PPI) devices, which have large-scale parallel multi-chip, are the key components of flexible DC transmission equipment. Due to the design and manufacture of the PPI devices, the internal clamping force on the parallel chips may be unbalanced, while the unbalanced internal clamping force cannot be tested directly. In this paper, a method to simulate the influence of the unbalanced internal clamping force on multi-chip module by a parallel finite element model of single-chip devices is proposed. Firstly, based on the effect of pressure on single-chip devices, a parallel finite element model of PPI is established. The distribution of the electro-thermal characteristics in parallel multi-chip devices under different internal clamping force is then simulated. Secondly, a test experiment platform with two single PPI devices running in parallel was established to verify the parallel simulation model. Finally, the parallel model was used in the simulation of the actual PPI module of 3 300V/1 500A, and the influence of the unbalanced clamping force of the multi-chip parallel module on the electro-thermal characteristics was analyzed. The results show that the unbalanced clamping force affects the electrical and thermal characteristics of the multi-chip parallel device. The thermal resistance changing with the clamping force is a significant factor in the temperature distribution of the parallel device. With the increase of the pressure inhomogeneity, the difference in electro-thermal characteristics among the parallel multi-chips becomes more obvious. Furthermore, the temperature difference caused by the unbalanced clamping force increases with the aging of the device, which affects the reliability of the device seriously.

Key words： Press-pack IGBT unbalanced clamping force electro-thermal distribution parallel multi-chip simulation

Received: 03 May 2018 Published: 02 September 2019

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TN304

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	Zhou Jing
	Kang Shengyang
	Li Hui
	Yao Ran
	Li Jinyuan

Cite this article:

Zhou Jing,Kang Shengyang,Li Hui等. Simulation of Influence of Unbalanced Clamping Force on Electro-Thermal Characteristics of Press-Pack IGBT Devices[J]. Transactions of China Electrotechnical Society, 2019, 34(16): 3408-3415.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.180769 OR https://dgjsxb.ces-transaction.com/EN/Y2019/V34/I16/3408

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