基于MOSFET外特性参量的自适应模糊神经网络状态评估模型

doi:10.19595/j.cnki.1000-6753.tces.171022

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Abstract Solder delamination is one of the main failure modes of power modules. An accurate method to assess its healthy condition is particularly important for improving system reliability. This paper focuses on MOSFET modules, which are widely used in the power electronic system. Under a certain driving voltage condition, a healthy assessment model is proposed based on the on-state resistance, case temperature and current. First, an electrical-thermal coupling model is established to discuss the electrical and thermal characteristics of MOSFET under different delamination degrees of the solder layer. Then, the sensitivities of different characteristic parameters to solder delamination are investigated under different conditions. It indicates that, under the same operating conditions, the increment of the on-state resistance has a higher sensitivity. Finally, the external characteristic parameters are introduced to represent the working condition, such as case temperature, on-state resistance and current. Based on the adaptive neuro-fuzzy inference system (ANFIS), a healthy assessment model is built to predict module aging rate and classify the healthy condition grade interval. This method is easy to monitor data extraction and has high precision, which can provide guidance to rational use of modules, condition-based maintenance and other practical applications.

Key words： MOSFET electrical-thermal coupling solder fatigue on-state resistance characteristic parameters healthy assessment

Received: 14 July 2017 Published: 26 September 2018

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TN306

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	Wang Yueyue
	Chen Minyou
	Lai Wei
	Chen Yigao
	Luo Dan

Cite this article:

Wang Yueyue,Chen Minyou,Lai Wei等. Healthy Condition Assessment on MOSFETs Based on External Characteristic Parameters and Adaptive Neuro-Fuzzy Inference System[J]. Transactions of China Electrotechnical Society, 2018, 33(18): 4286-4294.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.171022 OR https://dgjsxb.ces-transaction.com/EN/Y2018/V33/I18/4286

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