基于三维热电耦合有限元模型的IGBT失效形式温度特性研究

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Abstract Aluminium wire bonding lift-off and solder delamination are the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D electro-thermal coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, and compares the influence degree of two kinds of failure modes to the performance of IGBT module. The results suggest the bonding lift-off has more influence than the solder delamination on the same load and boundary condition. This method and the corresponding results help to evaluate these failure modes how they influence the performance of IGBT, determine the failure, establish the failure standards and find the optimization of structure design.

Key words： Thermal-electric coupling finite element IGBT bonding lift-off solder delamination numerical simulation

Received: 21 July 2009 Published: 07 March 2014

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TN306

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	Articles by authors
	Zheng Libing
	Han Li
	Liu Jun
	Wen Xuhui

Cite this article:

Zheng Libing,Han Li,Liu Jun等. Investigation of the Temperature Character of IGBT Failure Mode Based on 3D Thermal-Electro Coupling FEM[J]. Transactions of China Electrotechnical Society, 2011, 26(7): 242-246.

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http://dgjsxb.ces-transaction.com/EN/ OR http://dgjsxb.ces-transaction.com/EN/Y2011/V26/I7/242

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