电工技术学报  2024, Vol. 39 Issue (16): 5104-5120    DOI: 10.19595/j.cnki.1000-6753.tces.231755
电力电子 |
用于IGBT模块温度观测的3-D降阶混合型热模型
田野1, 卜凯阳1,2, 李楚杉1,2, 李武华1, 何湘宁1
1.浙江大学电气工程学院 杭州 310027;
2.浙江大学伊利诺伊大学厄巴纳香槟校区联合学院 海宁 314400
A Hybrid 3-D Reduced-Order Thermal Model for Temperature Observation of IGBT Modules
Tian Ye1, Bu Kaiyang1,2, Li Chushan1,2, Li Wuhua1, He Xiangning1
1. College of Electrical Engineering Zhejiang University Hangzhou 310027 China;
2. Zhejiang University-University of Illinois at Urbana-Champaign Institute Haining 314400 China
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摘要 IGBT模块温度在线监测是提高大容量变流器可靠性的关键技术。在IGBT模块在线温度监测方法中,热阻模型法可对IGBT模块内部的温度分布进行估计,因而受到关注。结合了传感器数据的温度观测器可基于热阻模型,实时修正材料老化、参数温度依赖性和功率损耗计算误差等不确定因素对温度估计造成的影响。然而现有热模型无法同时兼顾系统可观性和建模准确性,且阶数相对较高,难以应用于温度观测器的在线运行。因此,该文提出了一种适用于风冷散热多芯片IGBT模块3-D温度观测器,同时满足可观性、准确性和实时性要求的混合型降阶热模型。首先,分析了热阻模型的拓扑结构及其参数辨识的方法,并探究了模型的状态空间生成规律;然后,基于非线性优化算法对该模型的参数进行修正,以减小因计算流体力学(CFD)仿真模型参数与实际参数不一致所引入的热阻模型与实验物理对象间的误差;随后,使用平衡截断法对热阻模型降阶,相对于现有集总参数热阻模型,进一步提高了实时求解效率;最后,通过仿真和实验验证了所提模型的准确性。
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田野
卜凯阳
李楚杉
李武华
何湘宁
关键词 IGBT模块温度监测热网络模型温度观测器    
Abstract:Online monitoring of IGBT module temperature is a key technology for enhancing the reliability of high-power converters. Among the various online temperature monitoring methods for IGBT modules, the thermal network method has garnered attention due to its ability to estimate the internal temperature distribution within the IGBT module. The temperature observer based on the thermal network model can correct the model by utilizing measurement information to reduce the impact of aging, temperature-dependent material parameters, and power loss calculation errors on temperature estimation accuracy. However, existing thermal models struggle to balance system observability and modeling accuracy, and their high model order complicates their application in temperature observers. Therefore, an observable reduced-order hybrid 3-D thermal model suitable for temperature observer for forced air-cooling multi-chip IGBT modules is proposed in this paper.
Firstly, a hybrid thermal network combining the strengths of the 3-D Cauer model and the Foster model is introduced for air-cooling multi-chip IGBT modules. This model ensures both thermal modeling accuracy and observability for air-cooled IGBT modules. Based on this model's structure, the corresponding state-space expression is also derived. Secondly, a nonlinear optimization algorithm is employed to refine and calibrate the thermal network model using experimental temperature measurements, reducing the deviation between thermal model parameters and actual parameters caused by uncertain material parameters in the computational fluid dynamics (CFD) model. Finally, the balanced truncation method is utilized to further reduce the order of the proposed thermal network model's state space while maintaining model accuracy.
In summary, the main contributions of this paper are:
(1) The proposed lumped parameter 3-D thermal network model addresses the challenge that existing reduced-order thermal models cannot accurately model air-cooling IGBT modules with system observability. The error between the proposed thermal network model and CFD simulation is less than 5%, whereas the existing 3-D Cauer model exhibits a maximum error exceeding 34%.
(2) The nonlinear optimization algorithm is applied to further correct model parameters. Experimental results demonstrate that this model parameter correction method can decrease the discrepancy between the model and the actual IGBT module by up to 78.69%.
(3) The order of the thermal model's state space is further reduced from 270 to 38 by the balanced truncation method, while the model accuracy is still guaranteed within 100 Hz, which further improves the computational efficiency compared to lumped parameter thermal network models.
In the future, based on the observable 3-D reduced-order thermal model proposed in this paper and incorporating sensor measurement information, the temperature observer will be further designed to reduce the impact of aging and loss calculation errors on temperature estimation, which can enhance the reliability of thermal monitoring for high-power IGBT modules.
Key wordsIGBT module    temperature monitoring    thermal network model    thermal observer   
收稿日期: 2023-09-26     
PACS: TM46  
基金资助:国家重点研发计划(2022YFE0138400)和浙江省重点研发计划(2023C01061)资助项目
通讯作者: 李楚杉 男,1986年生,博士,研究员,研究方向为中压大容量变换技术。E-mail:chushan@intl.zju.edu.cn   
作者简介: 田 野 男,1994年生,博士研究生,研究方向为功率半导体器件状态监测。E-mail:11710020@zju.edu.cn
引用本文:   
田野, 卜凯阳, 李楚杉, 李武华, 何湘宁. 用于IGBT模块温度观测的3-D降阶混合型热模型[J]. 电工技术学报, 2024, 39(16): 5104-5120. Tian Ye, Bu Kaiyang, Li Chushan, Li Wuhua, He Xiangning. A Hybrid 3-D Reduced-Order Thermal Model for Temperature Observation of IGBT Modules. Transactions of China Electrotechnical Society, 2024, 39(16): 5104-5120.
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