电工技术学报  2021, Vol. 36 Issue (12): 2505-2521    DOI: 10.19595/j.cnki.1000-6753.tces.201437
先进功率半导体器件及其封装、集成与应用专题(特约主编:王来利 教授) |
压接型IGBT器件封装退化监测方法综述
李辉, 刘人宽, 王晓, 姚然, 赖伟
输配电装备及系统安全与新技术国家重点实验室(重庆大学) 重庆 400044
Review on Package Degradation Monitoring Methods of Press-Pack IGBT Modules
Li Hui, Liu Renkuan, Wang Xiao, Yao Ran, Lai Wei
State Key Laboratory of Power Transmission Equipment & System Security and New Technology Chongqing University Chongqing 400044 China