In power electronic systems, when SiC MOSFET is turned on incorrectly due to breakdown devices, hardware circuit defects or system control errors, at least two devices work in the short-circuit current loop, forming series short-circuit faults. Based on the half-bridge structure, the switching principle of SiC MOSFETs in short-circuit was introduced in detail. To study the influence mechanism of load current, gate drive voltage and junction temperature, the short circuit test was carried out under different experimental situations. The drain-source voltage sharing model of SiC MOSFET was derived and verified by simulation. The changes of short-circuit loss and junction temperature distribution caused by circuit parameters were compared on the 1 200V/80A SiC MOSFET experimental bench. The results show that the dynamic characteristics of SiC MOSFET are highly sensitive to circuit parameters in series short-circuit. The unbalanced dynamic change of drain-source voltage and drain current affect the short-circuit loss of devices, which in turn changes the junction temperature distribution.
张经纬, 张甜, 冯源, 宋明轩, 谭国俊. SiC MOSFET串联短路动态特性[J]. 电工技术学报, 2021, 36(12): 2446-2458.
Zhang Jingwei, Zhang Tian, Feng Yuan, Song Mingxuan, Tan Guojun. Dynamic Characterization Assessment on Series Short-Circuit of SiC MOSFET. Transactions of China Electrotechnical Society, 2021, 36(12): 2446-2458.
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