Research on Electrothermal Coupling Model of Fully-Immersed Evaporative Cooling IGBT
Zhang Yubin1,2, Wen Yingke1, Ruan Lin1,2
1. Institute of Electrical Engineering Chinese Academy of Sciences Beijing 100190 China; 2. University of Chinese Academy of Sciences Beijing 100049 China
Abstract:The development trend of miniaturization and high integration of power electronic devices poses a challenge to the heat dissipation technology. Compared with indirect liquid cooling, insulated gate bipolar transistor (IGBT) using fully-immersed evaporative cooling technology has the advantages of low device temperature rise and uniform temperature distribution. Therefore, its application in IGBT cooling has feasibility and superiority. This paper presents a modeling method for the electrothermal coupling model of IGBT with fully-immersed evaporative cooling technology. Firstly, based on the parameter fitting method, the electrical model of IGBT module is established to calculate the power loss. Secondly, according to the equivalent thermal conductivity, the thermal model of IGBT under the condition of fully-immersed evaporative cooling technology is established, and then under the assumption of linear time invariant system, the reduced order model of IGBT under fully-immersed evaporative cooling technology is obtained. Finally, the simulation and experimental results show that the proposed model can accurately characterize the electrical, thermal and coupling characteristics of IGBT, and has the advantages of simple model parameter extraction method and fast simulation speed.
[1] Baliga B J.The IGBT device: physics, design and applications of the insulated gate bipolar transistor[M]. Kidlington, Oxford; Waltham, MA: William. [2] Qian Cheng, Gheitaghy A M, Fan Jiajie, et al.Thermal management on IGBT power electronic devices and modules[J]. IEEE Access, 2018, 6: 12868-12884. [3] 顾国彪, 阮琳, 刘斐辉, 等. 蒸发冷却技术的发展、应用和展望[J]. 电工技术学报, 2015, 30(11): 1-6. Gu Guobiao, Ruan Lin, Liu Feihui, et al.Developments, applications and prospects of evaporative cooling technology[J]. Transactions of China Electrotechnical Society, 2015, 30(11): 1-6. [4] Du Bin, Hudgins J L, Santi E, et al.Transient electrothermal simulation of power semiconductor devices[J]. IEEE Transactions on Power Electronics, 2010, 25(1): 237-248. [5] Musallam M, Johnson C M.Real-time compact thermal models for health management of power electronics[J]. IEEE Transactions on Power Electronics, 2010, 25(6): 1416-1425. [6] Reichl J, Ortiz-Rodríguez J M, Hefner A, et al. 3-D thermal component model for electrothermal analysis of multichip power modules with experimental validation[J]. IEEE Transactions on Power Electronics, 2015, 30(6): 3300-3308. [7] Riccio M, De Falco G, Maresca L, et al.3D electro-thermal simulations of wide area power devices operating in avalanche condition[J]. Microelectronics Reliability, 2012, 52(9/10): 2385-2390. [8] D'Alessandro V, Magnani A, Riccio M, et al. Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations[J]. Micro-electronics Reliability, 2013, 53(9/10/11): 1713-1718. [9] Jia Yingjie, Xiao Fei, Duan Yaoqiang, et al.PSpice-COMSOL-based 3-D electrothermal-mechanical modeling of IGBT power module[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(4): 4173-4185. [10] Batard C, Ginot N, Antonios J.Lumped dynamic electrothermal model of IGBT module of inverters[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(3): 355-364. [11] di Napoli F, Magnani A, Coppola M, et al. On-line junction temperature monitoring of switching devices with dynamic compact thermal models extracted with model order reduction[J]. Energies, 2017, 10(2): 189. [12] Alavi O, Abdollah M, Hooshmand V A.Assessment of thermal network models for estimating IGBT junction temperature of a buck converter[C]//2017 8th Power Electronics, Drive Systems & Technologies Conference (PEDSTC), Mashhad, Iran, 2017: 102-107. [13] Li Xiang, Li Daohui, Qi Fang, et al.EM-electrothermal analysis of semiconductor power modules[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(8): 1495-1503. [14] Rosu M, Wu X, Cendes Z, et al.A novel electrothermal IGBT modeling approach for circuit simulation design[C]//2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and Exposition, Austin, TX, USA, 2008: 1685-1689. [15] 杨世铭, 陶文铨. 传热学[M]. 4版. 北京: 高等教育出版社, 2006. [16] 温英科, 阮琳. 全浸式蒸发冷却开关电源热分析及实验[J]. 电工技术学报, 2018, 33(18): 4295-4304. Wen Yingke, Ruan Lin.Thermal analysis and experimental study of fully-immersed evaporative cooling switching mode power supply[J]. Transactions of China Electrotechnical Society, 2018, 33(18): 4295-4304. [17] Hu Xiao, Lin Shaohua, Stanton S.A novel thermal model for HEV/EV battery modeling based on CFD calculation[C]//2010 IEEE Energy Conversion Congress and Exposition, Atlanta, GA, USA, 2010: 893-900. [18] 王永康, 张义芳. ANSYS Icepak进阶应用导航案例[M]. 北京: 中国水利水电出版社, 2016. [19] Xu Qianming, Ma Fujun, He Zhixing, et al.Analysis and comparison of modular railway power conditioner for high-speed railway traction system[J]. IEEE Transactions on Power Electronics, 2017, 32(8): 6031-6048. [20] (德)安德列亚斯·福尔克(Andreas Volke),(德)麦克尔·郝康普(Michael Hornkamp). IGBT模块: 技术、驱动和应用[M]. 韩金刚, 译. 北京: 机械工业出版社, 2016. [21] 刘平, 李海鹏, 苗轶如, 等. 基于内置温度传感器的碳化硅功率模块结温在线提取方法[J]. 电工技术学报, 2021, 36(12): 2522-2534. Liu Ping, Li Haipeng, Miao Yiru, et al.Online junction temperature extraction for SiC module based on built-in temperature sensor[J]. Transactions of China Electrotechnical Society, 2021, 36(12): 2522-2534. [22] 彭程, 李学宝, 张冠柔, 等. 压接型IGBT芯片动态特性实验平台设计与实现[J]. 电工技术学报, 2021, 36(12): 2471-2481. Peng Cheng, Li Xuebao, Zhang Guanrou, et al.Design and implementation of an experimental platform for dynamic characteristics of press-pack IGBT chip[J]. Transactions of China Electrotechnical Society, 2021, 36(12): 2471-2481.