电工技术学报  2021, Vol. 36 Issue (12): 2471-2481    DOI: 10.19595/j.cnki.1000-6753.tces.201445
先进功率半导体器件及其封装、集成与应用专题(特约主编:王来利 教授) |
压接型IGBT芯片动态特性实验平台设计与实现
彭程, 李学宝, 张冠柔, 赵志斌, 崔翔
新能源电力系统国家重点实验室(华北电力大学) 北京 102206
Design and Implementation of an Experimental Platform for Dynamic Characteristics of Press-Pack IGBT Chip
Peng Cheng, Li Xuebao, Zhang Guanrou, Zhao Zhibin, Cui Xiang
State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University Beijing 102206 China
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摘要 压接型IGBT芯片在正常的运行工况下承受着电-热-力多物理量的综合作用,研究电-热-力影响下的IGBT芯片动态特性对于指导IGBT芯片建模以及规模化IGBT并联封装设计具有重要意义。为了全面获得电-热-力综合影响下压接型IGBT芯片的动态特性,该文结合双脉冲测试电路原理,研制出具备电-热-力灵活调节的压接型IGBT芯片动态特性实验平台。通过对动态特性实验平台关键问题进行有限元仿真计算,实现平台回路寄生电感、IGBT芯片表面压力分布及机械夹具温度分布的优化设计。在此基础上建立压接型IGBT芯片动态特性实验平台,对实验平台进行综合调试,结果表明,该文所设计的实验平台具有寄生电感小、IGBT芯片表面压力分布均衡及机械夹具各组件温度分布合理的特点,可以满足电-热-力综合影响因素下压接型IGBT芯片动态特性实验的需求。
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彭程
李学宝
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赵志斌
崔翔
关键词 压接型IGBT芯片动态特性寄生电感温度机械压力    
Abstract:The press-pack IGBT chip is subjected to the comprehensive action of electro- thermo-mechanical under normal operating conditions. The study of the dynamic characteristics of IGBT chip under the influence of electro-thermo-mechanical is of great significance for guiding the modeling of IGBT chips and the design of large-scale IGBT parallel packaging. In order to obtain the dynamic characteristics of the press-pack IGBT chip under the comprehensive influence of electro- thermo-mechanical, in this paper, an experimental platform with a flexible electro-thermo-mechanical adjustment for the dynamic characteristics of the press-pack IGBT chip is developed, combined with the principle of the double pulse test circuit. Through the finite element simulation of the key problems of the dynamic characteristic experimental platform, the optimal design of parasitic inductance, IGBT chip surface pressure distribution and mechanical fixture temperature distribution is realized. On this basis, an experimental platform for dynamic characteristics of press-pack IGBT chip is established. Through comprehensive testing of the dynamic characteristic experimental platform, it is shown that the experimental platform has the characteristics of small parasitic inductance, balanced pressure distribution on the IGBT chip surface, and reasonable temperature distribution of each component of the mechanical fixture, which can meet the requirements of the dynamic characteristic test of the press-pack IGBT chip under comprehensive electro-thermo-mechanical influence.
Key wordsPress-pack IGBT chip    dynamic characteristics    parasitic inductance    temperature    mechanical pressure   
收稿日期: 2020-11-01     
PACS: TN307  
基金资助:国家自然科学基金-国家电网公司联合基金重点项目(U1766219)和国家电网有限公司科技项目(520201190095)资助
通讯作者: 李学宝 男,1988年生,博士,副教授,研究方向为先进输电技术、电力系统电磁环境与电磁兼容、高压大功率半导体器件封装 技术。E-mail: lxb08357x@ncepu.edu.cn   
作者简介: 彭程,男,1993年生,博士研究生,研究方向高压大功率半导体器件测试与封装技术。E-mail:pengcheng@ncepu.cn
引用本文:   
彭程, 李学宝, 张冠柔, 赵志斌, 崔翔. 压接型IGBT芯片动态特性实验平台设计与实现[J]. 电工技术学报, 2021, 36(12): 2471-2481. Peng Cheng, Li Xuebao, Zhang Guanrou, Zhao Zhibin, Cui Xiang. Design and Implementation of an Experimental Platform for Dynamic Characteristics of Press-Pack IGBT Chip. Transactions of China Electrotechnical Society, 2021, 36(12): 2471-2481.
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https://dgjsxb.ces-transaction.com/CN/10.19595/j.cnki.1000-6753.tces.201445          https://dgjsxb.ces-transaction.com/CN/Y2021/V36/I12/2471