An Overview of Mechanical Stress Wave in Power Electronics Device/Module Based on Acoustic Emission Testing Technology
Li Mengchuan1, He Yunze1,2, Meng Zhiqiang1, Zhou Yanan1, Li Yunjia2
1. College of Electrical and Information Engineering Hunan University Changsha 410082 China; 2. State Key Laboratory of Electrical Insulation and Power Equipment Xi'an Jiaotong University Xi'an 710049 China
Abstract：Some institutions have studied the mechanical stress wave that can characterize the condition of power electronic device/module, but these studies are scattered in signal extraction, signal analysis, and state characterization, and have not systematically summarized. Firstly, in this paper, the basic content of mechanical stress wave is discussed. The generation mechanism, detection circuits and signal processing methods applicable to power electronic devices/modules are summarized and compared. Then, the current research status of mechanical stress wave in power electronic devices/modules is reviewed. The composition mode, source mechanism, the relationship between frequency domain characteristics and health status of mechanical stress wave are summarized. Finally, the key issues of mechanical stress wave in power electronic devices/modules are analyzed from five aspects: mechanism analysis, research object, signal processing, state characterization and detection device, and future research directions are also proposed.
李孟川, 何赟泽, 孟志强, 周雅楠, 李运甲. 基于声发射检测技术的电力电子器件/模块机械应力波综述[J]. 电工技术学报, 2021, 36(22): 4773-4783.
Li Mengchuan, He Yunze, Meng Zhiqiang, Zhou Yanan, Li Yunjia. An Overview of Mechanical Stress Wave in Power Electronics Device/Module Based on Acoustic Emission Testing Technology. Transactions of China Electrotechnical Society, 2021, 36(22): 4773-4783.
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