A Coupled 3D Finite Element-Circuit Model for the Numerical Analysis of Small Time Scale Transients of an Insulated Gate Bipolar Transistor Power Electronics Device
Ma Yuhan, Chen Jiajia, Hu Sideng, Yang Shiyou
College of Electrical Engineering Zhejiang University Hangzhou 310027 China
Abstract:To consider the effect of the displacement current and the skin effect of the electromagnetic phenomenon as well the stray parameters in a small time scale electromagnetic transient, which are not properly muddled in the existing model, a coupled 3D finite element-circuit model of an IGBT based power electronics device for its transient performance computation in small and extreme small time scales is developed and an iterative solution methodology is proposed. In order to describe the skin effect and displacement current, a three-dimensional (3D) finite element model of IGBT is developed; In order to model the influence of stray parameters, a high-order distributed circuit model of the whole power electronics system is proposed, and the numerical method for stray parameters computation is included. From the analysis of the internal electromagnetic transient process of an IGBT, an improved IGBT circuit model is proposed. In order to balance the accuracy and the computational cost of the high order circuit model of a complete power electronics system, a reduction method is proposed. The comparisons between the simulated and tested results evidence the feasibilities and merits of the proposed work.
马瑜涵, 陈佳佳, 胡斯登, 杨仕友. IGBT电力电子系统小时间尺度动态性能分析与计算的电磁场-电路耦合模型[J]. 电工技术学报, 2017, 32(13): 14-22.
Ma Yuhan, Chen Jiajia, Hu Sideng, Yang Shiyou. A Coupled 3D Finite Element-Circuit Model for the Numerical Analysis of Small Time Scale Transients of an Insulated Gate Bipolar Transistor Power Electronics Device. Transactions of China Electrotechnical Society, 2017, 32(13): 14-22.
[1] 王群京, 陈权, 姜卫东, 等. 中点钳位型三电平逆变器通态损耗分析[J]. 电工技术学报, 2007, 22(3): 66-71. Wang Qunjing, Chen Quan, Jiang Weidong, et al. Analysis of conduction losses in neutral point clamped three level inverter[J]. Transactions of China Electrotechnical Society, 2007, 22(3): 66-71. [2] Chen Cai, Pei Xuejun. A stray parameter extracting method for high power converters based on turn- on/off transient analysis[J]. Proceedings of the CSEE, 2011, 31(21): 40-46. [3] Yuan Liqiang, Yu Hualong, The large-size low- stray-parameter planar bus bar for high power IGBT-based inverters[C]//2012 15th International Conference on Electrical Machines and Systems, Sapporo, Japan, 2012: 1-5. [4] Yuan Liqiang, Yu Hualong, Wang Xuesong, et al. Design, simulation and analysis of the low stray inductance bus bar for voltage source inverters[C]// Proceedings of 14th International Conference on Electrical Machines and Systems (ICEMS 2011), Beijing China, 2011: 1-5. [5] Qiu Jian, Liu Kefu. Stray parameters in a novel solid state pulsed power modulator[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2013, 20(4): 1020-1025. [6] Wladislaw Waag, Stefan K. Application specific parameterization of reduced order equivalent circuit battery models for improved accuracy at dynamic load[J]. Measurement, 2013, 46(10): 4085-4093. [7] Redondo L M. Comparison between two solid-state transformerless modulators for capacitive type load applications[C]//IEEE Power Modulator and High Voltage Conference, 2010: 278-281. [8] Wu Yifan, Liu Kefu, Qiu Jian, et al. Repetitive and high voltage marx generator using solid-state devices[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2007, 14(4): 937-940. [9] Dong Xin. The pole-zero cancellation of the transfer function and the dynamic characteristic of electric network[J]. Journal of Electrical & Electronic Education, 2004. [10] 郑利兵, 韩立, 刘钧, 等. 基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J]. 电工技术学报, 2011, 26(7): 242-246. Zheng Libing, Han Li, Liu Jun, et al. Investigation of the temperature character of IGBT failure mode based on 3D thermal-electro coupling FEM[J]. Transactions of China Electrotechnical Society, 2011, 26(7): 242-246. [11] 陈明, 胡安, 唐勇, 等. 绝缘栅双极型晶体管传热模型建模分析[J]. 高电压技术, 2011, 37(2): 453- 459. Chen Ming, Hu An, Tang Yong, et al. Modeling analysis of IGBT thermal model[J]. High Voltage Engineering, 2011, 37(2): 453-459. [12] Palmer P R, Tseng K J. Modeling of power semiconductor devices for use in circuits simulations[C]// IEEE Power Electronics Spec. Conference, 1994, 1: 38-43. [13] Sheng K, Finney S J, Williams B W. A newanalytical IGBT model with improved electrical characteristics[J]. IEEE Transactions on Power Electronics, 1999, 14(1): 98-107. [14] Kang X, Wang X, Caiafa A, et al. Physical modeling of IGBT turn on behavior[C]//IEEE Annual Industry Applications Conference, 2003, 2: 988-994. [15] 张健, 吕长志, 张小玲, 等. 基于ANSYS的IGBT热模拟与分析[J]. 微电子学, 2011, 41(1): 139-142. Zhang Jian, Lü Changzhi, Zhang Xiaoling, et al. Thermal simulation and analysis of IGBT based on ANSYS[J]. Microelectronics, 2011, 41(1): 139-142. [16] 赵起越. 1200V TRENCH-FS型IGBT的设计[D]. 成都: 电子科技大学, 2013. [17] 胡建辉, 李锦庚, 邹继斌, 等. 变频器中的IGBT模块损耗计算及散热系统设计[J]. 电工技术学报, 2009, 24(3): 159-163. Hu Jianhui, Li Jingeng, Zou Jibin, et al. Losses calculation of IGBT module and heat dissipation system design of inverters[J]. Transactions of China Electrotechnical Society, 2009, 24(3): 159-163.