Abstract:The trench field-stop (FS) configuration represents the latest generation of the insulated gate bipolar transistor (IGBT). The trench gate and plane gate have great differences in base carrier transportation and gate junction capacitance calculation. Hence, error would exist inevitably if the modeling method still follows the plane gate configuration. Therefore, based on the analysis of the trench FS structure and the modeling coordinate, base region is divided into PNP and PIN components considering 2D effects of base carrier transportation. The calculation methods of gate junction capacitance are thus analyzed according to whether the trench gate in the PIN part is covered by the depletion layer in the PNP part. Finally, the proposed mathematical modeling method of the transient process of the trench FS IGBT was verified by simulations and experiments.
汪波, 罗毅飞, 刘宾礼, 普靖. 沟槽栅场终止型IGBT瞬态数学模型[J]. 电工技术学报, 2017, 32(12): 50-57.
Wang Bo, Luo Yifei, Liu Binli, Pu Jing. Transient Mathematical Model of Trench Field-Stop IGBT. Transactions of China Electrotechnical Society, 2017, 32(12): 50-57.
[1] 袁寿财. IGBT场效应半导体功率器件导论[M]. 北京: 科学出版社, 2007. [2] 维捷斯拉夫·本达. 功率半导体器件—理论及应用[M]. 北京: 化学工业出版社, 2005. [3] 王兆安, 张明勋. 电力电子设备设计和应用手册[M]. 北京: 机械工业出版社, 2002. [4] Chen Xudong, Cheng Jianbing, Teng Guobing, et al. Novel trench gate field stop IGBT with trench shorted anode[J]. Journal of Semiconductors, 2016, 37(5): 61-64. [5] Qian Mengliang, Li Zehong, Zhang Bo, et al. Trench gate IGBT structure with floationg P region[J]. Journal of Semiconductors, 2010, 31(2): 11-13. [6] Fu Qiang, Zhang Bo, Luo Xiaorong, et al. A dual-gate and dielectric-inserted lateral trench insulated gate bipolar transistor on a silicon- on-insulator substrate[J]. Chinese Physics B, 2013, 22(7): 1-5. [7] Oh Hs, Nokali M. A new IGBT behavioral model[J]. Solid State Electronics, 2001, 45(4): 2069-2075. [8] Benbahouche L, Merabet A. numerical simulation and analysis of IGBT turn-off characteristic: dv/dt capability[C]//Proceedings of International Conference on Electrical and Electronics Engineering, Bursa, Turkey, 2007. [9] Busatto G, Ianuzzo F, Grimaldi P. Lumped charge PSPICE model for high-voltage IGBTs[C]//IEEE Industry Applications Conference, Rome, Italy, 2000: 896-902. [10] Lu L, Chen Z, Bryant A, et al. Modeling of MOS-side carrier injection in trench-gate IGBTs[J]. IEEE Transaction on Industry Application, 2010, 46(2): 875-883. [11] Bryant A T, Lu Liqing, Santi E, et al. Modeling of IGBT resistive and inductive turn-on behavior[J]. IEEE Transactions on Industry Application, 2008, 44(3): 904-914. [12] Iannuzzo F, Busatto G. Physical CAD model for high voltage IGBTs based on lumped-charge approach[J]. IEEE Transactions on Power Electron, 2004, 19(4): 885-893. [13] Hefner A R. An improved understanding for the transient operation of the power insulated gate bipolar transistor (IGBT)[J]. IEEE Transactions on Power Electron, 1990, 5(3): 995-1005. [14] Hefner A R. Characterization and modeling of the power insulated gate bipolar transistor[D]. University of Maryland, USA, 1987. [15] Udrea F, Amaratunga G A. 2-D modeling and optimization of trench insulated gate bipolar transistors (TIGBT)[C]//International Symposium on Power Semiconductor Devices and ICs (ISPSD), 1995: 190-195. [16] Udrea F, Chan S, Thomson J. Development of the next generation of insulated gate bipolar transistors based on trench technology[C]//The 27th European Solid-State Device Research Conference, 1997: 504-507. [17] Sheng K. Design, modelling and application of the IGBT[D]. Edinburgh: Heriot-Watt University, 1999. [18] 唐勇, 陈明, 汪波, 等. 场终止型绝缘栅双极型晶体管的开关瞬态模型[J]. 中国电机工程学报, 2011, 31(30): 54-60. Tang Yong, Chen Ming, Wang Bo, et al. Switching transient model of field-stop IGBT[J]. Proceeding of the CSEE, 2011, 31(30): 54-60.