直流GIL中固-气界面电荷特性研究综述Ⅱ：电荷调控及抑制策略

doi:10.19595/j.cnki.1000-6753.tces.181040

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摘要直流气体绝缘输电线路（GIL）中的固-气界面电荷积聚问题是导致其绝缘水平下降的重要因素,探究固-气界面电荷的主动调控及抑制方法对于直流GIL的研发具有重要的工程意义。本文在直流GIL中固-气界面电荷特性研究综述Ⅰ的基础上,从绝缘结构优化、绝缘子表面处理以及绝缘子材料掺杂改性三个方面总结归纳了目前现有的电荷调控及抑制手段,并对它们的优势和不足进行评价。最后,本文对未来直流GIL绝缘子的结构和材料设计进行展望,认为取向结构在绝缘子表面的应用为抑制电荷积聚提供了新的思路,同时,发挥绝缘子结构和材料改性的协同作用,达到自适应调控电荷的目的,是未来“智能”绝缘子设计的方向。

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关键词 ：直流, 气体绝缘输电线路, 表面电荷, 表面改性, 氟化, 掺杂, 综述

Abstract：Charge accumulation at gas-solid interface is an important factor that causes the decrease of insulation performance in DC gas-insulated transmission line (GIL). Therefore, it is of great significance to explore the charge control and suppression strategy for the development of a DC GIL. In this paper, based on the Review Part Ⅰ, the current charge control and suppression methods were summarized from three aspects: insulation structure optimization, insulator surface modification, and bulk doping of the insulator material. Their advantages and disadvantages were evaluated. Finally, prospects for future structure and material design of GIL insulators were presented. Using orientated structure on the insulator surface provides a new idea for suppressing charge accumulation. Meanwhile, the synergistic effect of the insulator structure and material modification should be adopted to adaptively control the charge, which is the direction of designing “smart” insulators in the future.

Key words： DC gas-insulated transmission line surface charge surface modification fluorination doping review

收稿日期: 2018-06-19 出版日期: 2018-11-27

PACS:

TM85

基金资助:国家重点基础研究发展计划（973计划）（2014CB239502）资助项目

通讯作者: 张博雅男,1990年生,博士,讲师,研究方向为气体绝缘电气设备、气体放电及等离子体、以及电介质材料。E-mail: zhangby@xjtu.edu.cn

作者简介: 张贵新男,1963年生,博士,教授,博士生导师,研究方向为等离子体技术、光电测量、气体绝缘电气设备及电介质材料。E-mail: guixin@tsinghua.edu.cn

引用本文:

张博雅, 张贵新. 直流GIL中固-气界面电荷特性研究综述Ⅱ：电荷调控及抑制策略[J]. 电工技术学报, 2018, 33(22): 5145-5158. Zhang Boya, Zhang Guixin. Review of Charge Accumulation Characteristics at Gas-Solid Interface in DC GIL, Part Ⅱ: Charge Control and Suppression Strategy. Transactions of China Electrotechnical Society, 2018, 33(22): 5145-5158.

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