基于电磁-流场耦合的轨道冷却仿真分析

doi:10.19595/j.cnki.1000-6753.tces.200372

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摘要轨道加速器连续工作时,轨道局部温升过高会严重影响其结构强度,有必要对其温升和冷却效果进行仿真分析。该文从分析轨道加速器的动态特性出发,给出电枢运动状态下轨道热源加载、多次加速的时间步长差异等关键问题的解决方法。基于Ansys-APDL语言,编程实现了轨道冷却的电磁-流场耦合仿真分析。无水冷工况下,在连续5次加速后轨道最高温度已超过铜材软化温度400℃。通过分析冷却水参数对轨道冷却效果的敏感度,最终选取体积浓度为50%的乙二醇水溶液作为冷却液。在连续7次加速后,冷却液与轨道最高温度基本不再上升,且轨道最高温度为308.7℃,未超过铜材料的软化温度。该仿真方法和结果对轨道加速器的热管理具有一定的指导意义。

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	古刚
	吴立周
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关键词 ：轨道加速器, 冷却, 耦合场, 有限元

Abstract：In the successive progress of the rail accelerator, too high local temperature rise in the rails will seriously affect its structural strength, it is necessary to analyze it’s temperature and cooling. Begin with the analysis of the dynamic characteristics of the rail accelerator, the key problems such as the heat source loading of the rails and the time step difference of multiple accelerations were solved. Based on programming of ANSYS-APDL, the electromagnetic-fluid coupling simulation analysis of rails’ cooling was realized. Without Water Cooling, after 5 successive accelerations the maximum temperature of the rails has exceeded the copper softening temperature by 400℃.By analyzing the sensitivity of the cooling water parameters to the cooling effect, the 50% volume concentration of ethylene glycol water solution was selected as the cooling solution. After 7 consecutive accelerations, the maximum temperature of the cooling solution and the rails do not increase, and the highest temperature of the rails is 308.7℃, which do not exceed the softening temperature of the copper material. The simulation method and results can be used to guide the thermal management of the rail accelerator.

Key words： Rail accelerator cooling coupling fields finite element

收稿日期: 2020-04-17

PACS:	TM15
	TJ012.1

通讯作者: 吴立周,男,1986年生,工程师,研究方向为电磁发射技术。E-mail：ceseml2004@sina.com

作者简介: 古刚,男,1970年生,博士研究生,研究方向为电磁发射技术。E-mail：gugang2003@163.com

引用本文:

古刚, 吴立周, 耿昊, 赵玺. 基于电磁-流场耦合的轨道冷却仿真分析[J]. 电工技术学报, 2020, 35(17): 3601-3608. Gu Gang, Wu Lizhou, Geng Hao, Zhao Xi. Simulation and Analysis of Rail Cooling Based on Electromagnetic and Fluid Field Coupling. Transactions of China Electrotechnical Society, 2020, 35(17): 3601-3608.

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