Thermal Analysis and Improved Thermal Network Model of IGBT Module for Wind Power Converter Considering Solder Fatigue Effects
Li Hui1, Hu Yaogang1, Liu Shengquan2, Li Yang1, Liu Zhixiang3
1. State Key Laboratory of Power Transmission Equipment & System Security and New Technology Chongqing University Chongqing 400044 China; 2. State Grid Jiangxi Electric Power Corporation Ganzhou Power Supply Company Ganzhou 341000 China; 3. Chongqing KK-QIANWEI Wind Power Equipment Co. Ltd Chongqing 401121 China
Abstract：Due to the influences of different fatigue lifetime stages on the junction temperature of the insulated gate bipolar transistor (IGBT) module in wind power converter, this paper analyzes the thermal resistance characteristics in different solder desquamating degrees, and then presents an improved thermal network model of the IGBT module. First, based on the structures and material parameters of the IGBT module of wind power converters, the coupling thermal-structure 3D finite element fatigue model of IGBT module is established. The junction temperature and thermal stress of IGBT module are investigated in different desquamating degrees of base plate solder and chip solder. Second, the thermal resistance parameters are determined in different desquamating degrees, and the improved thermal network model considering solder fatigue effects is established. Finally, the results of junction temperature calculated by the improved thermal network model are compared with those by the 3D finite element fatigue model, which testify the effectiveness of the improved thermal network model.
李辉, 胡姚刚, 刘盛权, 李洋, 刘志祥. 计及焊层疲劳影响的风电变流器IGBT模块热分析及改进热网络模型[J]. 电工技术学报, 2017, 32(13): 80-87.
Li Hui, Hu Yaogang, Liu Shengquan, Li Yang, Liu Zhixiang. Thermal Analysis and Improved Thermal Network Model of IGBT Module for Wind Power Converter Considering Solder Fatigue Effects. Transactions of China Electrotechnical Society, 2017, 32(13): 80-87.
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2017, Vol. 32 
