Effect of Chopped Fiber Concentration on PMIA Paper Properties and Analysis of Structure-Activity Relationship Mechanism
Fan Xiaozhou1,2, Yang Rui1, Fan Sidi1,2, Liu Yunpeng1,2, Lü Fangcheng1,2
1. College of Electrical and Electronic Engineering North China Electric Power University Beijing 102206 China; 2. Hebei Key Laboratory of Power Transmission Equipment Security Defense North China Electric Power University Baoding 071003 China
Abstract：In order to study the effect of chopped fiber concentration on the insulation and mechanical properties of PMIA paper and its structure-activity relationship mechanism, samples of PMIA paper with different chopped fiber concentration were prepared, tensile strength, Young's modulus, breakdown strength, conductivity and charge trap were tested, the test results of samples with different fiber concentration were compared, and the structure-activity relationship mechanism was analyzed by combining phase field breakdown simulation and molecular dynamics simulation. The results showed that with the increase of chopped fiber concentration, the mechanical properties of meta-aramid paper initially increased and then decreased, with the optimum performance reached at a weight fraction of 20% of chopped fiber, and the tensile strength and Young's modulus reached 31.9 MPa and 2.39 GPa, respectively. When the weight fraction of chopped fiber reaches 30%, the chopped fiber forms a "layered cross-linking" structure, which enhances its hindering effect on carrier migration, and its breakdown strength is higher than that of pure pulp paper, reaching 180.9 kV/mm. Firstly, the PMIA paper was prepared using the wet-laid method with tunable chopped fiber concentration. 2 000 mL of DI water, 130 mL of PEO solution (weight fraction = 0.052%), and precipitated fibers are mixed together into a fiber dissociator and dissociated at a rate of 30 00 r/min for 5 minutes. The chopped fibers are then added together and the dissociation is continued for 25 minutes. Next, the suction filtration and paper making are performed. The prepared paper is dried in a vacuum at 110℃ for 20 minutes to remove most of the moisture. The as prepared paper is then placed on a heating plate for flatness and kept for completely dry before taking it out for later use. Finally, the paper was hot pressed three times using a flat vulcanizer and a chrome plated mold with parameters of 270℃, 10 MPa, and 10 s. The composite paper prepared by this process has a diameter of (200±2) mm and a thickness of (0.16±0.02) mm. We prepared samples of meta aramid insulation paper with different chopped fiber contents, and tested their microstructure, mechanical properties, and electrical properties. We used phase field simulation and molecular dynamics calculations to explain the mechanism of their structure-activity relationship, and obtained the following conclusions: (1) The surface of meta aramid paper without chopped fibers presents a very dense structure. With the introduction of chopped fibers, obvious defects begin to appear between the chopped fibers and at the interface with the pulp. At the same time, the hot pressing process brings a layered structure to the meta aramid paper, which is severely damaged when the weight fraction of chopped fibers reaches 40%. But when the weight fraction of chopped fibers is 30%, a cross-linked layered structure appears in the sample. (2) The sample without chopped fibers exhibited the worst mechanical properties. As the content of chopped fibers is increased, the tensile strength of the paper is gradually increased, and reached its best at a weight fraction of 20%. Its tensile strength and Young's modulus are increased by 31.8% and 30.6%, respectively, compared to pure pulp paper. (3) The optimal insulation performance of the meta aramid paper sample occurs when the short cut weight fraction is 30%, and its breakdown strength reaches 180.9 kV/mm. At the same time, it also exhibits the highest trap depth and the lowest conductivity. Its cross-linked structure compensates for the interface defects and brings more effective hindrance to carrier migration.
范晓舟, 杨瑞, 樊思迪, 刘云鹏, 律方成. 短切纤维含量对间位芳纶纸性能影响及其构效关系机理分析[J]. 电工技术学报, 2024, 39(21): 6921-6931.
Fan Xiaozhou, Yang Rui, Fan Sidi, Liu Yunpeng, Lü Fangcheng. Effect of Chopped Fiber Concentration on PMIA Paper Properties and Analysis of Structure-Activity Relationship Mechanism. Transactions of China Electrotechnical Society, 2024, 39(21): 6921-6931.
[1] 刘云鹏, 来庭煜, 刘嘉硕, 等. 特高压直流换流阀饱和电抗器振动声纹特性与松动程度声纹检测方法[J]. 电工技术学报, 2023, 38(5): 1375-1389. Liu Yunpeng, Lai Tingyu, Liu Jiashuo, et al.Vibration voiceprint characteristics and looseness detection method of UHVDC converter valve saturable reactor[J]. Transactions of China Electrotechnical Society, 2023, 38(5): 1375-1389. [2] 廖瑞金, 柳海滨, 柏舸, 等. 纳米SiO2/芳纶绝缘纸复合材料的空间电荷特性和介电性能[J]. 电工技术学报, 2016, 31(12): 40-48. Liao Ruijin, Liu Haibin, Bai Ge, et al.Space charge characteristics and dielectric properties of nano-SiO2/ aramid paper composite[J]. Transactions of China Electrotechnical Society, 2016, 31(12): 40-48. [3] 张文琦, 范晓舟, 李宇轩, 等. 基于分子动力学的芳纶/功能化碳纳米管复合材料体系热力学性能模拟研究[J]. 电工技术学报, 2024, 39(5): 1510-1523. Zhang Wenqi, Fan Xiaozhou, Li Yuxuan, et al.Simulation of thermodynamic properties of aramid/ functionalized carbon nanotubes composites based on molecular dynamics[J]. Transactions of China Electrotechnical Society, 2024, 39(5): 1510-1523. [4] 黄峻峰, 秋向飞, 刘志华, 等. 交直流复合电压下纳米Al2O3改性绝缘纸板介电与电荷特性研究[J]. 高压电器, 2022, 58(12): 138-146. Huang Junfeng, Qiu Xiangfei, Liu Zhihua, et al.Study on dielectric and charge properties of nano-Al2O3 modified paperboard under AC-DC composite voltage[J]. High Voltage Apparatus, 2022, 58(12): 138-146. [5] 律方成, 路修权, 刘贵林, 等. 纳米Al2O3-STPP@HACC核壳填料的制备及其对间位芳纶绝缘纸性能的影响[J]. 华北电力大学学报(自然科学版), 2024, 51(2): 112-122. Lü Fangcheng, Lu Xiuquan, Liu Guilin, et al.Preparation of nano-Al2O3-STPP@HACC core-shell filler and its effect on the properties of meta-aramid insulating paper[J]. Journal of North China Electric Power University (Natural Science Edition), 2024, 51(2): 112-122. [6] 马林泉, 赵成龙, 熊雪梅, 等. 我国耐高温非纤维素绝缘纸的现状和发展动向[J]. 绝缘材料, 2021, 54(12): 15-21. Ma Linquan, Zhao Chenglong, Xiong Xuemei, et al.Status and development trends of high-temperature resistant non-cellulose insulating papers in China[J]. Insulating Materials, 2021, 54(12): 15-21. [7] 胡健, 王宜, 曾靖山, 等. 芳纶纸基复合材料的研究进展[J]. 中国造纸, 2004, 23(1): 49-52. Hu Jian, Wang Yi, Zeng Jingshan, et al.Progress in development of aramid paper[J]. China Pulp & Paper, 2004, 23(1): 49-52. [8] 宋欢, 刘卓峰, 白书欣, 等. 间位芳纶纸板的制备及性能研究[J]. 绝缘材料, 2015, 48(6): 9-12, 17. Song Huan, Liu Zhuofeng, Bai Shuxin, et al.Study on preparation and properties of meta-aramid paperboard[J]. Insulating Materials, 2015, 48(6): 9-12, 17. [9] 张素风, 刘文, 张美云. 芳纶纤维及芳纶浆粕对纸基结构和性能的影响[J]. 西南交通大学学报, 2010, 45(5): 805-810. Zhang Sufeng, Liu Wen, Zhang Meiyun.Effect of aramid fibre and pulp morphologies on properties of sheet[J]. Journal of Southwest Jiaotong University, 2010, 45(5): 805-810. [10] 廖瑞金, 李萧, 杨丽君, 等. 间位芳纶短切纤维/浆粕的配比对芳纶绝缘纸性能的影响[J]. 高电压技术, 2015, 41(2): 364-373. Liao Ruijin, Li Xiao, Yang Lijun, et al.Effect of the ratios of aramid fiber to pulp on the properties of aramid paper[J]. High Voltage Engineering, 2015, 41(2): 364-373. [11] 李梦洁, 董杰, 赵昕, 等. 纳米芳纶增强芳纶浆粕绝缘复合纸的制备及性能研究[J]. 绝缘材料, 2020, 53(9): 13-18. Li Mengjie, Dong Jie, Zhao Xin, et al.Preparation and properties of nano-aramid reinforced aramid pulp insulating composite paper[J]. Insulating Materials, 2020, 53(9): 13-18. [12] 张慧, 张美云, 李金宝, 等. 间位芳纶原液涂覆增强芳纶绝缘纸的性能研究[J]. 中国造纸, 2023, 42(7): 1-9. Zhang Hui, Zhang Meiyun, Li Jinbao, et al.Study on the properties of meta-aramid spinning stock solution coated aramid insulation paper[J]. China Pulp & Paper, 2023, 42(7): 1-9. [13] 顾思琦, 胡祖明, 于俊荣, 等. 涂覆聚间苯二甲酰间苯二胺浆液提高间位芳纶纸电气强度的研究[J]. 绝缘材料, 2022, 55(9): 28-34. Gu Siqi, Hu Zuming, Yu Junrong, et al.Study on electric strength of meta-aramid paper improved by coating poly(m-phthaloyl-m-phenylenediamine) slurry[J]. Insulating Materials, 2022, 55(9): 28-34. [14] 李进, 薛润东, 赵仁勇, 等. 基于声弹效应的芳纶增强环氧复合材料残余应力检测技术研究[J]. 电工技术学报, 2023, 38(9): 2519-2527. Li Jin, Xue Rundong, Zhao Renyong, et al.Residual stress detection technology for aramid reinforced epoxy composites based on acoustic-elastic effect[J]. Transactions of China Electrotechnical Society, 2023, 38(9): 2519-2527. [15] 李进, 赵仁勇, 杜伯学, 等. 电工环氧绝缘件缺陷无损检测方法研究进展[J]. 电工技术学报, 2021, 36(21): 4598-4607. Li Jin, Zhao Renyong, Du Boxue, et al.Research progress of nondestructive detection methods for defects of electrical epoxy insulators[J]. Transactions of China Electrotechnical Society, 2021, 36(21): 4598-4607. [16] 李进, 赵仁勇, 陈允, 等. 水分含量影响玻璃纤维增强环氧树脂电树枝生长特性研究[J]. 电工技术学报, 2023, 38(5): 1166-1176, 1189. Li Jin, Zhao Renyong, Chen Yun, et al.Effects of moisture contents on electrical treeing process in glass fiber reinforced epoxy resin[J]. Transactions of China Electrotechnical Society, 2023, 38(5): 1166-1176, 1189. [17] 朱敏慧, 闵道敏, 高梓巍, 等. 直流电缆用交联聚乙烯绝缘的击穿概率及其尺度效应仿真[J]. 电工技术学报, 2024, 39(4): 1172-1184. Zhu Minhui, Min Daomin, Gao Ziwei, et al.Breakdown probability and size effect simulation of XLPE insulation for DC power cables[J]. Transactions of China Electrotechnical Society, 2024, 39(4): 1172-1184. [18] Lü Fangcheng, Yang Rui, Ruan Haoou, et al.Effect of anti-hydrolysis AlN microspheres on the electrical insulation and thermal conductivity of PMIA paper[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2023, 30(4): 1674-1680. [19] Li Chuanyang, Hu Jun, Lin Chuanjie, et al.The control mechanism of surface traps on surface charge behavior in alumina-filled epoxy composites[J]. Journal of Physics D: Applied Physics, 2016, 49(44): 445304. [20] 李志辉, 解曾祺, 李庆民, 等. 多巴胺接枝的纳米氮化硼改性环氧树脂绝缘表面电荷高频消散特性[J]. 电工技术学报, 2023, 38(5): 1116-1128. Li Zhihui, Xie Zengqi, Li Qingmin, et al.Study on the surface charge dissipation characteristics of epoxy resin modified by dopamine grafted nano boron nitride under high frequency electric stress[J]. Transactions of China Electrotechnical Society, 2023, 38(5): 1116-1128. [21] Bhatia A.Aramid papers with improved dimensional stability[C]//Proceedings: Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, Rosemont, IL, USA, 1995: 409-410. [22] Tian Jianzhong, Wang Jianhe.Nomex paper T-411 impregnated with adhesive varnish and its application[C]//Proceedings of 1998 International Symposium on Electrical Insulating Materials. 1998 Asian International Conference on Dielectrics and Electrical Insulation. 30th Symposium on Electrical Insulating Materials (IEEE Cat. No.98TH8286), Toyohashi, Japan, 1998: 337-339. [23] Yang Kerong, Chen Weijiang, Zhao Yushun, et al.Enhancing dielectric strength of epoxy polymers by constructing interface charge traps[J]. ACS Applied Materials & Interfaces, 2021, 13(22): 25850-25857. [24] Zhao Yushun, Xu Yufan, Shen Hao, et al.Introducing chlorine into epoxy resin to modulate charge trap depth in the material[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2022, 29(5): 1666-1674. [25] Zhao Yushun, He Yuanhan, Yang Kerong, et al.Improving the surface insulating performance of epoxy resin/Al2O3 composite materials by extending chain of liquid epoxy resin with Me-THPA[J]. High Voltage, 2020, 5(4): 472-481. [26] Zhang Cheng, Lin Haofan, Zhang Shuai, et al.Plasma surface treatment to improve surface charge accumulation and dissipation of epoxy resin exposed to DC and nanosecond-pulse voltages[J]. Journal of Physics D: Applied Physics, 2017, 50(40): 405203. [27] 杨小震. 分子模拟与高分子材料[M]. 北京: 科学出版社, 2002. [28] 朱孟兆, 陈玉峰, 辜超, 等. 基于分子动力学的无定形纤维素热力学性质仿真[J]. 高电压技术, 2015, 41(2): 432-439. Zhu Mengzhao, Chen Yufeng, Gu Chao, et al.Simulation on thermodynamic properties of amorphous cellulose based on molecular dynamics[J]. High Voltage Engineering, 2015, 41(2): 432-439. [29] Tang Chao, Zhang Song, Li Xu, et al.Molecular dynamics simulations of the effect of shape and size of SiO2 nanoparticle dopants on insulation paper cellulose[J]. AIP Advances, 2016, 6(12): 125106. [30] 廖瑞金, 胡舰, 杨丽君, 等. 变压器绝缘纸热老化降解微观机理的分子模拟研究[J]. 高电压技术, 2009, 35(7): 1565-1570. Liao Ruijin, Hu Jian, Yang Lijun, et al.Molecular simulation for thermal degradative micromechanism of power transformer insulation paper[J]. High Voltage Engineering, 2009, 35(7): 1565-1570. [31] Cai Ziming, Wang Xiaohui, Luo Bingcheng, et al.Nanocomposites with enhanced dielectric permittivity and breakdown strength by microstructure design of nanofillers[J]. Composites Science and Technology, 2017, 151: 109-114. [32] Shen Zhonghui, Wang Jianjun, Jiang Jianyong, et al.Phase-field modeling and machine learning of electric-thermal-mechanical breakdown of polymer-based dielectrics[J]. Nature Communications, 2019, 10: 1843. [33] Shen Zhonghui, Wang Jianjun, Lin Yuanhua, et al.High-throughput phase-field design of high-energy-density polymer nanocomposites[J]. Advanced Materials, 2018, 30(2): 1704380. [34] 张语桐, 吴泽华, 谢宗良, 等. 固体介质内绝缘损伤演化的相场模拟研究[J]. 中国电机工程学报, 2023, 43(17): 6885-6895. Zhang Yutong, Wu Zehua, Xie Zongliang, et al.Phase field simulation for internal insulation damage evolution in solid dielectric[J]. Proceedings of the CSEE, 2023, 43(17): 6885-6895.
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