电工技术学报  2018, Vol. 33 Issue (20): 4672-4681    DOI: 10.19595/j.cnki.1000-6753.tces.L80830
直流管道输电绝缘关键技术专题 |
等离子体复合薄膜沉积抑制金属微粒启举
程显1, 徐晖1,2, 王瑞雪2,3, 高远2,3, 章程2,3, 邵涛2,3
1. 郑州大学电气工程学院 郑州 450001;
2. 中国科学院电工研究所 北京 100190;
3. 中国科学院电力电子与电气驱动重点实验室 北京 100190
Composite Thin Film Deposited by Plasma to Inhibit the Lifting of Metal Particles
Cheng Xian1, Xu Hui1,2, Wang Ruixue2,3, Gao Yuan2,3, Zhang Cheng2,3, Shao Tao2,3
1. School of Electrical Engineering Zhengzhou University Zhengzhou 450001 China;
2. Institute of Electrical Engineering Chinese Academy of Sciences Beijing 100190 China;
3. Key Laboratory of Power Electronics and Electric Drive Chinese Academy of SciencesBeijing 100190 China