高压全膜电容器热稳定性能试验条件下的温度场特性

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摘要为了获得高压全膜电容器在热稳定性能试验条件下外壳与内部的温度分布,在Fluent 15.0中建立了电容器温度场仿真模型,并利用有限体积法进行了求解。仿真结果表明:对于电容器外壳,其小侧面温度较高,外壳最热点在小侧面,而电容器最热点则位于靠近尾部的中轴线上。由于电容器内部结构复杂,导致电容器外壳表面温度分布不均匀,并非规则的温度升高或降低的趋势,而是存在局部较热的区域。为了验证仿真模型的正确性,利用光纤光栅温度传感器及红外成像仪分别对热稳定性能试验条件下的电容器内部及外壳温度进行了实际测量,实测与仿真结果基本吻合从而验证了仿真模型的正确性。

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	王子建
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	徐志钮

关键词 ：高压全膜电容器, 热稳定性能试验, 温度场, 计算流体动力学, 红外成像

Abstract：To obtain the temperature distributions on the shell and in the core of high voltage film capacitors in the thermal stability test,a thermal field model for high voltage film capacitors is formulated in Fluent 15.0 and solved based on the finite volume method.The results reveal that the side surface is higher than other surfaces on the shell and the hottest spot on the capacitor shell is located on the side surface.The hottest spot in the entire capacitor is located on the central axis of the capacitor close to the tail part.The temperature distributions on the capacitor shell are non-uniform.Because of complexity of capacitor structure,the temperature does not always increase/decrease monotonically.And there are several local hot spots.A fiber grating capacitor temperature monitoring system and an infrared thermal imager are used to measure the temperatures of some key points on the shell and in the interior of a high voltage film capacitor respectively in the thermal stability test.The measured results are qualitatively and quantitatively consistent with the simulated results.

Key words： High voltage film capacitor thermal stability test thermal field computational fluid dynamics infrared imaging

收稿日期: 2015-07-21 出版日期: 2016-09-18

PACS:

TM53

基金资助:中央高校基本科研业务费专项资金资助项目(2015MS92)。

作者简介: 王子建男,1981年生,博士,讲师,研究方向为电力电容器与无功补偿。E-mail:electricpower@163.com;徐志钮男,1979年生,博士,副教授,研究方向为电力电容器建模及性能优化、光纤传感及在电力系统中的应用和电气设备状态监测与故障诊断等。E-mail:wzcnjxx@sohu.com(通信作者)

引用本文:

王子建,严飞,侯智剑,王崇祜,徐志钮. 高压全膜电容器热稳定性能试验条件下的温度场特性[J]. 电工技术学报, 2016, 31(17): 207-216. Wang Zijian,Yan Fei,Hou Zhijian,Wang Chonghu,Xu Zhiniu. Thermal Field Characteristics of High Voltage Film Capacitors in Thermal Stability Test. Transactions of China Electrotechnical Society, 2016, 31(17): 207-216.

链接本文:

https://dgjsxb.ces-transaction.com/CN/Y2016/V31/I17/207

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