计及IGBT器件典型工况的直流和交流功率循环测试方法对比

doi:10.19595/j.cnki.1000-6753.tces.241798

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摘要功率器件作为变换器的关键部件, 在能量转换和电能控制方面起着至关重要的作用, 因日益增长的功率密度及复杂的服役环境导致其可靠性问题愈发突出, 而功率器件可靠性测评依赖功率循环测试的老化参数在线获取及失效机理分析, 但现有直流功率循环测试与真实服役工况应力差异较大, 导致失效机理及数据准确性有待考证。因此, 开展功率器件直流和交流功率循环测试方法及结果对比分析研究, 对功率器件实际服役可靠性量测至关重要。该文针对功率器件可靠性研究的功率循环测试有效性问题开展研究。首先, 针对中低压变流器用焊接型IGBT器件直流及交流功率循环测试开展失效机理及数据对比分析。其次, 开展柔性直流换流阀用压接型IGBT器件直流及交流功率循环测试结果的失效模式及机理对比分析。最后, 总结分析不同应用场景下IGBT器件可靠性测评手段优缺点。结果表明：焊接型IGBT器件交流及直流功率循环测试的失效机理差异较小, 但交流功率循环测试可用于研究输出频率对功率器件可靠性的影响;基于非实际运行工况的压接型IGBT器件可靠性分析与测试结果不能有效表征器件真实工况下的失效物理过程。研究成果为不同服役场景的IGBT器件可靠性测评方法提供科学依据。

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关键词 ：直流功率循环测试, 交流功率循环测试, 失效机理, IGBT器件

Abstract：As key components of converters, power devices play a critical role in energy conversion and electric power control. However, due to the increasing power density and the complex operating environments, reliability issues of these devices have become more prominent. Device reliability evaluation depends on the online acquisition of aging parameters through power cycling tests and failure mechanism analysis. However, the existing DC power cycling tests show significant discrepancies from real-world operating stress conditions, resulting in uncertain failure mechanisms and data accuracy. Therefore, this paper addresses a widely concerning issue in the industry: whether it is necessary to consider real-world operating stress when conducting IGBT power cycling tests. It presents a comparative analysis of the differences between welded and press-pack IGBT devices under DC and AC power cycling tests, which is crucial for assessing the actual service reliability of power devices. The main research contents include the following aspects.
(1) Failure mechanism and data comparison for welded IGBT Devices under DC and AC power cycling tests for medium- and low-voltage converters. An experimental platform for AC power cycling, simulating typical conditions of wind power converters with adjustable frequency parameters and thermal load conditions, was established. Accelerated aging tests were performed to analyze the impact of frequency parameters on the failure evolution and lifetime of IGBT modules, and the results were compared with traditional DC power cycling tests. Experimental results show that different power cycling methods do not affect the failure modes of welded IGBTs, with packaging degradation being the primary failure mechanism. However, DC power cycling with DC excitation, which differs significantly from the actual operating conditions and neglects switching losses due to switching frequencies, makes it difficult to analyze the impact of output frequency on device reliability based on DC aging power cycling. It, in turn, affects the accuracy of device lifetime modeling and remaining lifetime prediction.
(2) Failure mode and data comparison for press-pack IGBT devices under DC and AC power cycling tests for flexible DC converter valve applications. For flexible DC converter valve applications, failure mode and data were compared for press-pack IGBT devices under DC and AC power cycling tests. An AC power cycling experimental platform was established to replicate the MMC submodule operating conditions, including capacitor voltage, arm current, and switching signals. Aging characteristics and microscopic morphological evolution were observed to analyze the long-term aging failure mechanisms of press-pack IGBT devices under MMC operating conditions. The identified failure modes were gate leakage current-induced open-circuit failure and avalanche breakdown-induced short-circuit failure. A comparison between AC and DC power cycling test results showed significant differences in failure modes. Under constant DC conditions, the device exhibited only open-circuit failure, whereas under AC conditions, both open-circuit and short-circuit failure modes occurred. It indicates that testing methods that do not reflect real operating conditions are insufficient to effectively characterize the failure process of press-pack IGBTs. Furthermore, applying a device lifetime model based on DC conditions to actual long-term reliability operations in engineering applications would overestimate the remaining life of the device, ultimately leading to increased system failure rates.

Key words： DC power cycling test AC power cycling test failure mechanism IGBT device

收稿日期: 2024-10-16

PACS:

TM46

基金资助:中央高校基本科研业务费项目（2022CDJKYJH009）和输变电装备技术全国重点实验室开放基金项目（SKLPET-kfkt202305）资助

通讯作者: 赖伟男, 1986年生, 博士, 副教授, 研究方向为电力电子器件可靠性和状态监测。E-mail: laiweicqu@126.com

作者简介: 王浩男, 2003年生, 硕士研究生, 研究方向为电力电子器件可靠性。E-mail: EEwanghao@stu.cqu.edu.cn

引用本文:

王浩, 赖伟, 吴云杰, 李辉, 何赟泽. 计及IGBT器件典型工况的直流和交流功率循环测试方法对比[J]. 电工技术学报, 2025, 40(20): 6686-6698. Wang Hao, Lai Wei, Wu Yunjie, Li Hui, He Yunze. Comparative Analysis DC and AC Power Cycling Test Methods Considering Typical Operating Conditions for IGBT Devices. Transactions of China Electrotechnical Society, 2025, 40(20): 6686-6698.

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