基于热解动力学的有机硅凝胶封装绝缘剩余寿命评估方法

doi:10.19595/j.cnki.1000-6753.tces.240518

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摘要

随着电能变换装备大量投入智能电网与新能源发电领域,功率器件封装绝缘的劣化状态与寿命评估逐渐成为研究热点,采用热分析动力学方法可为封装绝缘评估提供新的解决途径。该文首先推导出有机硅凝胶的微观热解动力学表征模型,建立了剩余寿命评估与温度积分P(u)、热解活化能E及绝缘失效温度T_f三个状态参量的关联关系,进而给出了高效求解模型状态参量的求解算法。验证结果表明,该文提出的温度积分算法在整个积分区间的精度都优于现有温度积分结果,改进Flynn-Wall-Ozawa法可使活化能的计算精度提升2%。同时,由微观判定法得出有机硅凝胶样品的绝缘失效温度为453℃,此时失重率仅为3.4%,明显低于国标推荐下的5%失重率,有助于建立更为合理的寿命失效判据。评估结果指出,温度对封装绝缘的影响较为显著,运行温度每升高10℃,绝缘寿命减少约60%。最后,通过有机硅凝胶加速热老化实验证明了使用该文所提模型进行寿命预测的准确性。上述研究结果可为封装绝缘的剩余寿命预测提供理论与方法基础。

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	王伟
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关键词 ：封装绝缘, 热失重分析, 活化能, 寿命预测

Abstract：

Power electronics is a prominent aspect and critical characteristic of the emerging power system, wherein power conversion equipment plays a vital role in facilitating energy conversion and delivery. The power electronic devices used in multi-energy conversion equipment are being designed to focus on high efficiency and power capabilities. Additionally, the high-frequency thermogenic effect is becoming increasingly prominent. As a result, the chip junction temperature typically reaches several hundred degrees. The silicone gel package insulation material is susceptible to aging and degradation while operating in high-temperature circumstances for extended periods, which can result in insulation failure. To solve this problem, this paper derives a microscopic pyrolysis kinetic characterization model for encapsulated insulation, proposes an efficient solution method for the three thermodynamic state parameters in the model, and then establishes a high-precision package insulation life assessment model.
Firstly, this research presents a model that characterizes the kinetics of pyrolysis for silicone gels at a microscopic level. A link is established between the remaining life assessment and the temperature integral P(u), the pyrolysis activation energy E, and the insulation failure temperature T_f. Subsequently, a solution algorithm is provided to determine the model state parameters efficiently. The validation results demonstrate that the temperature integration algorithm proposed in this paper outperforms the existing temperature integration results across the entire integration interval. Additionally, the enhancement of the Flynn-Wall-Ozawa method leads to a 2% increase in the accuracy of the activation energy calculation. At the same time, the insulation failure temperature of the silicone gel sample is 453℃ by the microscopic determination method, and the weight loss rate is only 3.4%, which is lower than the weight loss rate of 5% recommended by the national standard. This finding contributes to establishing a more rational criterion for life failure. The evaluation results indicate that temperature substantially impacts the package insulation. Specifically, for every 10℃ rise in operating temperature, the insulation life decreases by around 60%. Finally, the accuracy of the life prediction model provided in this research is demonstrated by an accelerated thermal aging experiment using silicone gel.
The following conclusions can be drawn from the experiments analysis: (1) Utilizing an enhanced temperature integration algorithm, a refined Flynn-Wall-Ozawa equation is formulated, resulting in a 2% enhancement in the precision of determining the activation energy of silicone gels compared to the conventional Flynn-Wall-Ozawa equation. (2) This study proposes a microscopic approach to determine the temperature at which insulation failure occurs in package materials. The results show that the silicone gel sample had insulation failure at a temperature of 453℃, with a weight loss of only 3.4%. (3) The evaluation results indicate that the temperature substantially affects the insulation of the package. The lifetime of the package decreases by approximately 60% for every 10℃ increase in operating temperature.

Key words： Package insulation thermal weight loss analysis activation energy lifetime prediction

收稿日期: 2024-04-01

PACS:

TM215

基金资助:

国家重点研发计划（2021YFB2601404）、国家自然科学基金（52177147, 52127812）、北京市自然科学基金（3232053）和中央高校基本科研业务费专项资金（2023JC005）资助项目

通讯作者: 王健男,1985年生,副教授,博士生导师,研究方向为高电压与绝缘技术、放电物理等。E-mail：wangjian31791@ncepu.edu.cn

作者简介: 王伟男,1996年生,博士研究生,研究方向为大功率电子器件封装绝缘寿命预测与老化状态评估。E-mail：wwncepu@163.cn

引用本文:

王伟, 李贝, 王健, 任瀚文, 李庆民. 基于热解动力学的有机硅凝胶封装绝缘剩余寿命评估方法[J]. 电工技术学报, 0, (): 2492929-2492929. Wang Wei, Li Bei, Wang Jian, Ren Hanwen, Li Qingmin. Remaining Life Assessment of Silicone Gel Package Insulation Based on Pyrolysis Kinetics. Transactions of China Electrotechnical Society, 0, (): 2492929-2492929.

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