基于壳温信息的功率器件可靠性分析

doi:10.19595/j.cnki.1000-6753.tces.220886

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摘要

功率器件的焊料层易受到温度波动逐步发生老化脱落,造成热量无法快速消散而在芯片处积聚,引起芯片过热损毁,造成功率器件突发失效,因此,焊料层老化的实时评估是实现功率器件可靠运行的重要保障。本文通过提出基于壳温的焊料层老化评估方法,分析了焊料层老化影响的壳温分布情况,建立了基于壳温的基板二维温度梯度模型对壳温分布变化规律,研究了壳温分布变化与热阻抗的关联情况,以焊料层老化程度作为中间变量,通过离线加速老化平台采集壳温分布和热阻抗的演化信息,建立基板二维温度梯度与热阻抗关系的数据库,在工程应用中,通过布设在器件基板和散热板之间的传感器测量壳温并计算二维温度梯度,通过数据库识别热阻抗值对器件可靠性进行评估。在仿真和实验的老化分析中,表征壳温分布的二维温度与热阻抗的变化趋势相同,当器件失效时,二维温度梯度和热阻抗分别增长了16.1%、20%和20.1%,表明二维温度梯度与热阻抗受焊料层老化影响是一致的,与现有的方法相比,该方法通过壳温便实现功率器件的可靠性评估。

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	崔曼
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	刘俊杰

关键词 ：功率器件, 焊料层老化, 可靠性, 温度梯度

Abstract：

The solder layer as the heat transfer channel of the power device is sensitive to temperature fluctuations. With the aging process of solder, the heat generated on the chip can not dissipate quickly, causing thermal damage. Real-time evaluation of solder aging is an important guarantee for the reliability of power devices. The thermal impedance from the chip to the substrate can characterize the solder aging, while the junction temperature for estimating the thermal impedance is expensive to obtain. From an economic point of view, this paper proposes a novel method to evaluate solder aging based on the case temperatures. Considering that the case temperature distribution is affected by solder aging, a two-dimensional temperature gradient model based on the case temperatures is built to describe the change of case temperature distribution, and the correlative mechanism between the case temperature distribution and the thermal impedance is studied. Taking solder aging as an intermediate variable, a database containing the 2-D temperature gradient and thermal impedance is established by an offline accelerated aging platform. In practice, the case temperature is measured by a sensor between the substrate and the heat dissipation plate and is used to calculate the 2-D temperature gradient. The reliability of the device is evaluated by identifying the thermal impedance based on the database. In the simulation and experiment analysis, the changing trend of the 2-D temperature gradient and thermal impedance is simultaneous. When the device fails, the 2-D temperature gradient and thermal impedance increase by 16.1%, 20%, and 20.1%, respectively, indicating that the 2-D temperature gradient and thermal impedance are affected by the solder aging in a consistent way. Compared with the existing methods, this method only depending on the case temperature to realize the reliability evaluation of the device is economic.

Key words： Power device solder aging reliability temperature gradient

收稿日期: 2022-05-19

PACS:

TM13

基金资助:

国家自然科学基金项目（62073173,62203052,61903126）、江苏省高等学校自然科学研究面上项目（TJ222027）、南邮电大学引进人才自然科学研究启动基金（NY219153）,陕西省自然科学基金（2020JQ-814）资助项目

通讯作者: 胡震, 男,1989 年生,讲师,研究方向为电力电子设备故障的智能化诊断。E-mail：huzhen0111@njupt.edu.cn;张腾飞, 男,1980年生,教授,硕士生导师,研究方向为智能信息处理技术。E-mail：tfzhang@126.com

作者简介: 崔曼, 女,1986年生,博士后,研究方向为复杂系统建模与评估。E-mail：15991637202@163.com;周岩, 男,1980年生,教授,研究方向为无线供电技术。E-mail：zhouyan@njupt.edu.cn ;贾蓉, 女,1987年生,讲师,研究方向为嵌入式系统监控技术及应用。E-mail：jiar@ces.org.cn;刘俊杰, 男,1989年生,博士,研究方向为先进控制理论应用。E-mail：liujj@ces.org.cn。

引用本文:

崔曼, 胡震, 张腾飞, 周岩, 贾蓉, 刘俊杰. 基于壳温信息的功率器件可靠性分析[J]. 电工技术学报, 0, (): 8901-. Cui Man, Hu Zhen, Zhang Tengfei, Zhou Yan, Jia Rong, Liu Junjie. Reliability Analysis of Power Device Based on the Case Temperatures. Transactions of China Electrotechnical Society, 0, (): 8901-.

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