电工技术学报  2019, Vol. 34 Issue (4): 703-716    DOI: 10.19595/j.cnki.1000-6753.tces.180296
电力电子 |
Si和SiC功率器件结温提取技术现状及展望
王莉娜1, 邓洁1, 杨军一1, 李武华2
1. 北京航空航天大学自动化科学与电气工程学院 北京 100191;
2. 浙江大学电气工程学院 杭州 310027
Junction Temperature Extraction Methods for Si and SiC Power Devices—a Review and Possible Alternatives
Wang Lina1, Deng Jie1, Yang Junyi1, Li Wuhua2
1. School of Automation Science and Electrical Engineering Beihang University Beijing 100191 China;
2. College of Electrical Engineering Zhejiang University Hangzhou 310027 China
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摘要 对功率半导体器件结温的在线准确提取是实现器件智能控制、性能评估、主动热管理、健康状态评估及优化器件寿命等的重要基础。本文梳理了现有基于温敏参数的Si(硅)和SiC(碳化硅)功率器件结温提取方法的机理和主要特点,从灵敏度、测量频率、侵入性和线性度等指标对已有方法进行了性能评估。在此基础上,结合SiC JFET(结型场效应晶体管)器件的温度特性,提出一种新颖的基于栅-源极间寄生PN结击穿电压的SiC JFET器件非侵入性在线结温提取方法,仿真结果证明了所提出方法的正确性和有效性。
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王莉娜
邓洁
杨军一
李武华
关键词 功率半导体器件碳化硅结温提取温敏参数    
Abstract:Accurate online extraction of junction temperature for power semiconductor devices is essential for intelligent switching control, performance evaluation, active thermal management, health assessment and device lifetime optimization. The main contribution of this paper is to thoroughly review the extraction theory and main features of the existing junction temperature extraction methods for Si and SiC devices. Furthermore, these methods were evaluated and compared from the criteria of sensitivity, measuring frequency, virulence and linearity. Then, together with the investigation of temperature characteristics of SiC JFET devices, a novel non-invasive junction temperature extraction method was proposed based on the gate reverse breakdown voltage of SiC JFET devices. The simulation results verified the correctness and effectiveness of the proposed method.
Key wordsPower semiconductor devices    Si    SiC    junction temperature extraction    temperature sensitive parameters   
收稿日期: 2018-03-12      出版日期: 2019-03-01
PACS: TM464  
基金资助:国家自然科学基金项目(51577005、51877005)和航空科学基金(2015ZC51030)资助
通讯作者: 邓洁 女,1993年生,硕士研究生,主要从事电力电子研究。E-mail: teddeng123@163.com   
作者简介: 王莉娜 女,1977年生,博士,特聘研究员,博士生导师,主要从事电力电子系统可靠性,碳化硅功率器件的建模、高性能驱动及应用,飞行器用电能变换器研究。E-mail: wangln@buaa.edu.cn
引用本文:   
王莉娜, 邓洁, 杨军一, 李武华. Si和SiC功率器件结温提取技术现状及展望[J]. 电工技术学报, 2019, 34(4): 703-716. Wang Lina, Deng Jie, Yang Junyi, Li Wuhua. Junction Temperature Extraction Methods for Si and SiC Power Devices—a Review and Possible Alternatives. Transactions of China Electrotechnical Society, 2019, 34(4): 703-716.
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