电工技术学报  2023, Vol. 38 Issue (18): 4963-4977    DOI: 10.19595/j.cnki.1000-6753.tces.221088
电力电子 |
基于拓扑优化的车用功率模块Pin-Fin设计方法
李恺颜, 曾正, 孙鹏, 王亮, 邹铭锐, 韩绪冬
输配电装备及系统安全与新技术国家重点实验室(重庆大学) 重庆 400044
Topology Optimization Design of Pin-Fin for Automotive Power Module
Li Kaiyan, Zeng Zheng, Sun Peng, Wang Liang, Zou Mingrui, Han Xudong
State Key Laboratory of Power Transmission Equipment & System Security and New Technology Chongqing University Chongqing 400044 China
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摘要 集成Pin-Fin散热器可以降低功率模块的结-流热阻,是车用电机控制器热管理的发展趋势。然而,传统参数设计方法无法定量表征Pin-Fin的形貌结构,设计自由度低、设计效果欠佳,难以实现Pin-Fin的热-流协同设计。基于变密度拓扑优化方法,该文提出一种Pin-Fin形貌结构的设计方法,建立Pin-Fin设计的变密度拓扑优化模型,分析模型参数对优化结果和收敛性的影响规律,形成以结-流热阻和冷却液压降为目标的协同优化方法,探索Pin-Fin结构的热-流耦合规律和强化换热方法,得到最优的Pin-Fin散热器形貌结构,搭建变流器实验平台和车用电机控制器样机,对标商业化圆形Pin-Fin结构,以及三角形、菱形和水滴形等其他形貌结构,计及母线电压、负荷电流和冷却液流量的影响,实验结果验证了所提模型方法的可行性和有效性。实验结果表明:基于拓扑优化方法设计的Pin-Fin结构,与传统结构相比可以降低12 %的结-流热阻,消除了多芯片结温差异的80 %,为车用功率模块和电机控制器研究提供新的思路。
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李恺颜
曾正
孙鹏
王亮
邹铭锐
韩绪冬
关键词 车用功率模块集成Pin-Fin散热器拓扑优化方法热-流协同优化设计    
Abstract:The integrated Pin-Fin heatsink can effectively reduce the junction-fluid thermal resistance of the automotive power module, which is a state-of-the-art and promising solution for the thermal management of the power control unit. It has shown that topological characterization plays a crucial role in the overall performance of the Pin-Fin heatsink. According to the basic geometric structures, such as circles, squares, and ellipses, the parameters of initial structures are simulated and experimentally analyzed using empirical enumeration or arrangement and combination. However, there are only numerical solution methods to optimize the Pin-Fin structure, which are time-consuming, high cost, and have a low degree of freedom. Limited by the existing geometry aspects, there needs to be a method capable enough to contain all geometrical aspects of the Pin-Fin structure to make the thermal-fluid co-optimal design.
Inspired by these research gaps, based on the topology optimization method and gradient descent algorithm, the varied-density-oriented mathematical model is proposed to characterize the Pin-Fin heatsink. Firstly, the detailed fluid field and thermal field control functions are analyzed, focusing on the PCU model. Then, penalty factors are applied in the material interpolation to characterize the relationship between the fluid and solid domains. The junction resistance and pressure drop are key indicators in the topology optimization formulation. Adjusting the weight factors achieves topology optimization results under specific design requirements. Besides the even power dissipation, the principle of unbalanced power dissipation on optimization results is analyzed. The topology optimization method can reasonably distribute materials under the unbalanced heat source and achieve the goal of minimizing the thermal-fluid co-optimal design.
The front-to-front converter is constructed to evaluate the performance of the optimized Pin-Fin structure. Comprehensive experiments are presented to ensure the feasibility and validity of proposed models and methodologies compared with the commercial circle, diamond, triangle, and teardrop structures. It is found that with the help of the topology optimization, the designed Pin-Fin heatsink reduces the junction-fluid thermal resistance by 12 % and eliminates the mismatched junction difference by 80 % compared with the traditional circular design. The diamond, triangle, and teardrop shape Pin-Fin heatsink prototypes are also analyzed under the same load current and busbar voltage. Even for the optimal diamond-shape Pin-Fin, the junction temperature is still higher than that of the structure proposed in this paper, which verifies the effectiveness of the design method.
The following conclusions can be drawn from the simulation and experiment analysis. Penalty factors affect the convergence of topology optimization. Building the multi-objective optimization model can accelerate the design speed and reduce the research and development cost. The topology optimization method has a high degree of design freedom to achieve the co-optimized design. The optimized structure can reduce chip temperature differences by 80 %, and the temperature gradient between each chip is less than 1 ℃. The thermal resistance can be reduced by 12 %, and the maximum temperature rise can be reduced by 6 ℃ under different load conditions. Experimental results verify that the optimized Pin-Fin structure can effectively improve the thermal performance and the reliability of the automotive power module.
Key wordsAutomotive power module    integrated Pin-Fin heatsink    topology optimization method    thermal-fluid co-optimal design   
收稿日期: 2022-06-10     
PACS: TM464  
基金资助:国家自然科学基金项目(52177169)、重庆市基础研究与前沿探求项目(cstc2021zdyjA0035)和重庆市研究生科研创新项目(CYS22023)资助
通讯作者: 曾正,男,1986年生,博士,教授,研究方向为新型电力电子器件封装集成与应用。E-mail: zengerzheng@126.com   
作者简介: 李恺颜,男,1998年生,硕士研究生,研究方向为新型电力电子器件封装集成与应用。E-mail: 535306488@qq.com
引用本文:   
李恺颜, 曾正, 孙鹏, 王亮, 邹铭锐, 韩绪冬. 基于拓扑优化的车用功率模块Pin-Fin设计方法[J]. 电工技术学报, 2023, 38(18): 4963-4977. Li Kaiyan, Zeng Zheng, Sun Peng, Wang Liang, Zou Mingrui, Han Xudong. Topology Optimization Design of Pin-Fin for Automotive Power Module. Transactions of China Electrotechnical Society, 2023, 38(18): 4963-4977.
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