Abstract：Integrated Pin-Fin heat-sink can reduce the junction-flow thermal resistance of the power module, and boost the power density and reliability of the power control unit for electric vehicle applications. It is considered as the trending technology of advanced thermal management for the automotive power module. However, due to the complex coupling of electro-thermal-flow multi- physics, the integrated Pin-Fin heat-sink is difficult to be analytically characterized and quantitatively optimized. In this paper, with the aid of the response surface approach, the model-oriented design method is proposed for the integrated Pin-Fin heat-sink to promote the thermal feature of the automotive power module and the reliability of the power control unit. The mathematical models are established to characterize the structure and layout, and the theoretical model of the thermal-flow performance of the Pin-Fin heat-sink is also established. Besides, by the central composite design method, the response surface model of the integrated Pin-Fin is proposed. The step-by-step procedure is proposed to optimize the design of the Pin-Fin heat-sink. Accordingly, a test rig using the front-to-front converter is set up. Compared with the Pin-Fin design of the commercial automotive power module, concerning fixed electric loading and actual mission profile, comprehensive experiments of the fabricated Pin-Fin prototypes are carried out. It is found that, the proposed optimized Pin-Fin can reduce 7.62% thermal resistance and 65% mechanical damage of the power module. As a result, it can increase the lifetime of the power control unit by 1.8 times. This paper is helpful for the low thermal resistance integrated Pin-Fin heat-sink for automotive applications.
张嘉伟, 曾正, 孙鹏, 王亮. 基于响应面的车用功率模块Pin-Fin优化设计[J]. 电工技术学报, 2022, 37(22): 5836-5850.
Zhang Jiawei, Zeng Zheng, Sun Peng, Wang Liang. Optimized Pin-Fin Design of Power Module for Electric Vehicle Application by Response Surface. Transactions of China Electrotechnical Society, 2022, 37(22): 5836-5850.
[1] Bhunia A, Chen C L.Jet impingement cooling of an inverter module in the harsh environment of a hybrid vehicle[C]//ASME Summer Heat Transfer Conference, San Francisco, USA, 2005: 561-567. [2] Liu Chunkai, Chao Yulin, Yang S J, et al.Direct liquid cooling for IGBT power module[C]// IEEE International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, China, 2014: 41-44. [3] Narumanchi S.Thermal management and reliability of power electronics and electric machines[C]//IEEE International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), Raleigh, USA, 2016: 1-13. [4] Wang Yangang, Jones S, Dai A, et al.Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles[J]. Microelectronics Reliability, 2014, 54(9-10): 1911-1915. [5] 付和平, 陈杰, 邱瑞昌, 等. 电力电子变流装置散热器状态智能预测方法[J]. 电工技术学报, 2021, 36(20): 4350-4358. Fu Heping, Chen Jie, Qiu Ruichang, et al.Intelligent prediction method for thermal dissipation state of heatsink in power electronic converter[J]. Transa- ctions of China Electrotechnical Society, 2021, 36(20): 4350-4358. [6] 孙林, 孙鹏菊, 罗全明, 等. 基于状态反馈线性化的IGBT外部热管理[J]. 电工技术学报, 2021, 36(8): 1636-1645. Sun Lin, Sun Pengju, Luo Quanming, et al.External thermal management of IGBT based on state feedback linearization[J]. Transactions of China Electrotech- nical Society, 2021, 36(8): 1636-1645. [7] Hua Junye, Li Gui, Zhao Xiaobao, et al.Study on the flow resistance performance of fluid cross various shapes of micro-scale pin fin[J]. Applied Thermal Engineering, 2016, 107: 768-775. [8] Hamadneh N, Khan W A, Sathasivam S, et al.Design optimization of pin fin geometry using particle swarm optimization algorithm[J]. PLoS One, 2013, 8(5): 1-9. [9] John T J, Mathew B, Hegab H.S-shaped pin-fins for enhancement of overall performance of the pin-fin heat sink[C]//ASME US-European Fluids Engineering Summer Meeting, Montreal, Canada, 2010: 1717-1725. [10] Kosar A, Peles Y.Micro scale pin fin heat sinks: parametric performance evaluation study[J]. IEEE Transactions on Components and Packaging Tech- nologies, 2007, 30(4): 855-65. [11] Chamanroy Z, Aliabadi M K.Analysis of straight and wavy miniature heat sinks equipped with straight and wavy pin-fins[J]. International Journal of Thermal Sciences, 2019, 146: 106071. [12] Yang Dawei, Wang Yan, Ding Guifu, et al.Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations[J]. Applied Thermal Engineering, 2017, 112: 1547-1556. [13] Gupta D, Saha P, Roy S.Computational analysis of perforation effect on the thermo-hydraulic perfor- mance of micro pin-fin heat sink[J]. International Journal of Thermal Sciences, 2021, 163: 106857. [14] Maji A, Bhanja D, Patowari P K.Numerical investigation on heat transfer enhancement of heat sink using perforated pin fins with inline and staggered arrangement[J]. Applied Thermal Engin- eering, 2017, 125: 596-616. [15] Khonsue O.Enhancement of the forced convective heat transfer on mini pin fin heat sinks with micro spiral fins[J]. Heat and Mass Transfer, 2018, 54(2): 563-570. [16] Menrath T, Rosskopf A, Simon F B, et al.Shape optimization of a pin fin heat sink[C]//IEEE Semi- conductor Thermal Measurement, Modeling & Mana- gement Symposium (SEMI-THERM), San Jose, USA, 2020: 10-16. [17] Yan Yunfei, Zhao Ting, He Ziqiang, et al.Numerical investigation on the characteristics of flow and heat transfer enhancement by micro pin-fin array heat sink with fin-shaped strips[J]. Chemical Engineering and Processing: Process Intensification, 2021, 160: 108273. [18] Ryu H C, Kim D, Kim S J.Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling[C]//IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, USA, 2002: 261-266. [19] Bhandari P, Prajapati Y K.Thermal performance of open microchannel heat sink with variable pin fin height[J]. International Journal of Thermal Sciences, 2021, 159: 106609. [20] Vilarrubí M, Riera S, Ibañez M, et al.Experimental and numerical study of micro-pin-fin heat sinks with variable density for increased temperature uniform- mity[J]. International Journal of Thermal Sciences, 2018, 132: 424-434. [21] Feng Shuai, Yan Yunfei, Li Haojie, et al.Temperature uniformity enhancement and flow characteristics of embedded gradient distribution micro pin fin arrays using dielectric coolant for direct intra-chip cooling[J]. International Journal of Heat and Mass Transfer, 2020, 156: 119675. [22] Chen Lingen, Yang Aibo, Feng Huijun, et al.Con- structal design progress for eight types of heat sinks[J]. Science China Technological Sciences, 2020, 63(6): 879-911. [23] Zhao Jin, Huang Shanbo, Gong Liang, et al.Numeri- cal study and optimizing on micro square pin-fin heat sink for electronic cooling[J]. Applied Thermal Engineering, 2016, 93: 1347-1359. [24] Xie Gongnan, Song Yidan, Asadi M, et al.Optimi- zation of pin-fins for a heat exchanger by entropy generation minimization and constructal law[J]. Journal of Heat Transfer, 2015, 137(6): 061901. [25] Zhao Ziyan, Hu Wweibing, Li Lei, et al.Strength variation of gas cooling turbine blade pin-fin with different array[J]. Materials Science and Engineering Technology, 2015, 46(1): 78-89. [26] Chiang K T, Chou C C, Liu N M.Application of response surface methodology in describing the thermal performances of a pin-fin heat sink[J]. International Journal of Thermal Sciences, 2009, 48(6): 1196-1205. [27] Wang Zhimin, Ye Guigen, Xue Shifeng, et al.Num- erical study and parametric optimization of pin-fin in the microchannel radiators with hot spots[C]//IEEE International Conference on Integrated Circuits and Microsystems (ICICM), Beijing, China, 2019: 70-74. [28] Sintamarean N C, Blaabjerg F, Wang Huai, et al.Reliability oriented design tool for the new generation of grid connected PV-inverters[J]. IEEE Transactions on Power Electronics, 2015, 30(5): 2635-2644. [29] 白万栋, 梁栋, 陈伟, 等. 非等直径柱肋阵列的冷却特性[J]. 航空动力学报, 2021, 36(3): 626-633. Bai Wandong, Liang Dong, Chen Wei, et al.Cooling characteristics of pin-fin arrays with non-uniform diameters[J]. Journal of Aerospace Power, 2021, 36(3): 626-633. [30] 曾正, 欧开鸿, 吴义伯, 等. 车用双面散热功率模块的热-力协同设计[J]. 电工技术学报, 2020, 35(14): 3050-3064. Zeng Zheng, Ou Kaihong, Wu Yibo, et al.Thermo- mechanical co-design of double sided cooling power module for electric vehicle application[J]. Transa- ctions of China Electrotechnical Society, 2020, 35(14): 3050-3064.
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