电工技术学报  2023, Vol. 38 Issue (10): 2589-2601    DOI: 10.19595/j.cnki.1000-6753.tces.220483
电工理论 |
不同分子量聚醚胺共混对环氧复合泡沫绝缘材料热性能及电气性能的影响分析
刘贺晨1, 董鹏1, 周松松2, 刘云鹏1, 魏利伟1, 李乐1
1.华北电力大学河北省绿色高效电工新材料与设备重点实验室 保定 071003;
2.中国电力科学研究院有限公司 北京 100192
Analysis of the Effect of Blending Different Molecular Weight Polyetheramines on the Thermal and Electrical Properties of Epoxy Composite Foam Insulation Materials
Liu Hechen1, Dong Peng1, Zhou Songsong2, Liu Yunpeng1, Wei Liwei1, Li Le1
1. Hebei Key Laboratory of Green and Efficient New Electrical Materials and Equipment North China Electric Power University Baoding 071003 China;
2. China Electric Power Research Institute Beijing 100192 China
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摘要 环氧基复合泡沫(SF)具有轻质高绝缘的特点,电气和理化性能优异,作为芯体绝缘材料具有良好的应用前景。该文使用聚醚胺作为SF材料树脂基体的固化剂,研究不同分子量的聚醚胺共混对SF材料固化反应机理、热学性能、力学性能及电气性能的影响。研究结果显示,随着高分子量的聚醚胺(D-2000)添加量的逐渐增加,固化时的内部温度出现明显下降,固化反应的放热量逐渐减少。但是当D-2000添加量在30 %~40 %时材料的拉伸强度、断裂伸长率以及材料的电气性能均有不同程度的下降。结果表明,不同分子量的聚醚胺共混的SF体系可明显减轻热集中带来的烧芯现象,其中D-2000含量为20 %时的SF材料综合性能优异,这为解决SF材料工艺生产问题和应用领域的扩展提供了新的思路。
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刘贺晨
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关键词 复合泡沫聚醚胺环氧树脂有机微球热性能    
Abstract:Epoxy-based composite foam (syntactic foam) uses hollow microspheres of low-density material as the lightweight phase and epoxy resin as the matrix phase. It has high porosity, low density, few internal defects, and good insulating properties, with good application prospects as a core insulating material. However, due to the large size of the insulating core, SF materials are prone to thermal concentration in the casting and curing process. It causes problems such as core burning and cracking within the material, greatly impacting the performance of the core after curing. By modifying the resin matrix in the SF material, the starting temperature of the epoxy resin-based cross-linking reaction and the reactivity of the curing agent are reduced. Thus, the curing speed of the SF material curing reaction and the amount of heat released can be reduced, alleviating the core burning phenomenon.
The characteristics of low viscosity, low reactivity, and high elongation of polyetheramines are combined with those of low density and high viscosity of SF systems. By blending polyetheramine curing agents of different molecular weights to obtain epoxy-based SF systems with suitable curing rates and heat release, the electrical and thermomechanical properties of the materials were also comprehensively evaluated to obtain suitable matrix formulations for insulation core applications. The internal temperature of the blended system during curing (40 ℃) is measured using thermocouples to clarify the actual temperature variation during curing. In addition, good electrical and thermal properties are required as core insulating material. It also needs to have a low water absorption rate. Breakdown strength, dielectric loss angle, leakage current, and thermal weight loss were measured for different SF materials, and the change in water absorption was tested for SF materials over 96 h. The interface between the microspheres and the resin matrix affects the performance of the SF materials. The degree of interfacial bonding between the microspheres and the resin matrix was observed by scanning electron microscopy (SEM).
The results show that SF material systems with lower curing reaction rates can be obtained by blending polyetheramines of different molecular weights. The internal peak curing temperature decreases from 185 ℃ to 113.5 ℃. With the gradual increase of the high molecular weight curing agent (D-2000), the electrical and thermal properties show different decrease degrees (breakdown voltage decreases from 28.53 kV/mm to 22.74 kV/mm; leakage current increases by 11.38 μA to 41.24 μA; and the 5 % thermal weight loss temperature decreases by up to 17 ℃). In addition, SEM tests determine that the different curing agent systems have little effect on the interfacial bond strength of the microspheres and the resin matrix. The influence of the interface on the change in material properties is excluded.
As the proportion of high molecular weight D-2000 curing agent increases, the activation energy of the curing reaction gradually increases, and the reaction rate decreases. It can significantly reduce the core temperature during curing and reduce the heat concentration phenomenon during curing. With the addition of the D-2000 curing agent, SF material thermal decomposition temperature, electrical properties, and water absorption slightly decrease but still meet the practical application.
Key wordsComposite foams    polyetheramines    epoxy resins    organic microspheres    thermal properties   
收稿日期: 2022-04-01     
PACS: TM21  
基金资助:中央高校基本科研业务费专项资金资助项目(2020MS088)
通讯作者: 李 乐 男,1993年生,博士,讲师,主要从事先进电工绝缘材料的研究。E-mail: lile@ncepu.edu.cn   
作者简介: 刘贺晨 男,1989年生,博士,副教授,主要从事环保型环氧树脂及其复合材料研制、电气设备绝缘状态评估及聚合物电树枝特性研究等方面的研究。E-mail: hc.liu@ncepu.edu.cn
引用本文:   
刘贺晨, 董鹏, 周松松, 刘云鹏, 魏利伟, 李乐. 不同分子量聚醚胺共混对环氧复合泡沫绝缘材料热性能及电气性能的影响分析[J]. 电工技术学报, 2023, 38(10): 2589-2601. Liu Hechen, Dong Peng, Zhou Songsong, Liu Yunpeng, Wei Liwei, Li Le. Analysis of the Effect of Blending Different Molecular Weight Polyetheramines on the Thermal and Electrical Properties of Epoxy Composite Foam Insulation Materials. Transactions of China Electrotechnical Society, 2023, 38(10): 2589-2601.
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