Abstract：As the power density of high frequency high power switched-mode power supply increases continuously, reasonable thermal design becomes a prerequisite to ensure the reliability of power supply. This paper presents a general thermal design method and describes how to design fans and heatsinks in detail. In order to optimize the structure of the power supply, the thermal field in the power supply is simulated by FLOTHERM. The practicality of the proposed design method is verified by a 15V/2kA high-frequency switched-mode power supply in the paper.
何文志, 丘东元, 肖文勋, 张波. 高频大功率开关电源结构的热设计[J]. 电工技术学报, 2013, 28(2): 185-191.
He Wenzhi, Qiu Dongyuan, Xiao Wenxun, Zhang Bo. Thermal Design of High Frequency High Power Switched-Mode Power Supply. Transactions of China Electrotechnical Society, 2013, 28(2): 185-191.
[1] Erik C W de Jong, Ferreira J A, Pavol Bauer. Design techniques for thermal management in switch mode converters[J]. IEEE Transactions on Industry Applications, 2006, 42(6): 1375-1386. [2] 徐殿国, 李向荣. 极限温度下的电力电子技术[J]. 电工技术学报, 2006, 21(3): 15-23. Xu Dianguo, Li Xiangrong. Power electronics in extreme temperature applications[J]. Transactions of China Electrotechnical Society, 2006, 21(3): 15-23. [3] 胡建辉, 李锦庚, 邹继斌, 等. 变频器中的IGBT模块损耗计算及散热系统设计[J]. 电工技术学报, 2009, 24(3): 159-163. Hu Jianhui, Li Jingeng, Zou Jibin, et al. Losses calculation of IGBT module and heat dissipation system design of inverters[J]. Transactions of China Electrotechnical Society, 2009, 24(3): 159-163. [4] 张舟云, 徐国卿, 沈祥林. 牵引逆变器散热系统的分析与设计[J]. 同济大学学报(自然科学版), 2004, 32(6): 775-778. Zhang Zhouyun, Xu Guoqing, Shen Xianglin. Analyzing and designing of dissipation system of inverter[J]. Journal of Tongji University(Natural Science), 2004, 32(6) : 775-778. [5] Chen Wenhwa, Cheng Hsienchie, Shen Hsinan. An effective methodology for thermal characterization of electronic packaging[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(1): 222-232. [6] Hannemann R. Electronic system thermal design for reliability[J]. IEEE Transactions on Reliability, 1977, 26(5): 306-310. [7] 祝效华, 余志样. ANSYS高级工程有限元分析范例精选[M]. 北京: 电子工业出版社, 2004. [8] 付桂翠, 王香芬, 姜同敏. 高可靠性航空电子设备热分析中的有限体积法[J]. 北京航空航天大学学报, 2006, 32(6): 716-720. Fu Guicui, Wang Xiangfen, Jiang Tongmi. Finite volume method in thermal analysis of avionics[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(6): 716-720. [9] Qing Fang, Tsuchiya T. Finite difference, finite element and finite volume methods applied to two-point boundary value problems[J]. Journal of Computational and Applied Mathematics, 2002, 139: 9-19. [10] Feistauer M, Felcman J, Lukacova Medvidova M. On the convergence of a combined finite volume-finite element method for nonlinear convection-diffusion problems[J]. Numerical Methods for PDEs, 1997, 13(2): 163-190. [11] 陈洁茹, 朱敏波, 齐颖. ICEPEAK在电子设备热设计中的应用[J] . 电子机械工程, 2005, 21(1): 14-16. Chen Jieru, Zhu Minbo, Qi Ying. Application of ICEPEAK in the thermal design of an electronic device[J]. Electro-Mechanical Engineerin, 2005, 21(1): 14-16. [12] 李波, 李科群, 俞丹海. Flotherm软件在电子设备热设计中的应用[J]. 电子机械工程, 2008, 24(3): 11-13. Li Bo, Li Kequn, Yu Danhai. Application of Flotherm software in the thermal design of electronic equipment[J]. Electro-Mechanical Engineering, 2008, 24(3): 11-13. [13] 杨旭, 裴云庆, 王兆安. 开关电源技术[M]. 北京: 机械工业出版社, 2004. [14] Hamidi A, Coquery G. Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions[J]. Microelectronics and Reliability, 1997, 37: 1755-1758. [15] Puqi Ning, Guangyin Lei, Fred Wang, et al. Selection of heatsink and fan for high-temperature power modules under weight constraint[C]. IEEE Applied Power Electronics Conference and Exposition, 2008, 2: 192-198.
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