Abstract：In order to better understand the temperature distribution of sealed electromechanical relay and its influence factors, a new modeling“space-filling-model”is introduced in this paper. The model can use one meshing model to simulate both close and open status through modifying the parameters of the filling material. Using software ANSYS, the paper simulates the transient temperature field of sealed electromechanical relay in the repeated short-term system. According to the calculation, the distribution of transient temperature field and its influence factors are summarized. Besides, the paper gives the relationship between the main heat source inside the relay and the current level. Finally, the paper puts forward an optimization method to decrease the temperature rise of the relay.
[1] 陈德桂. 低压开关电器热分析方法的进展[J]. 低压电器, 2008, 17: 1-4. [2] Kawase Y, Ichihashi T, Ito S. Heat analysis of thermal overload relays using 3-D finite element method [J]. IEEE Transactions on Magnetics, 1999, 35(3): 1658-1661. [3] Barcikowskif, Lindamayer M. Simulations of the heat balance in low-voltage switchgear[C]. Proceedings of 20th International Conference on Electrical Contacts, Sweden, 2000: 323-329. [4] Paulke J, Weichert H, Steinhaeuser P. Thermal simulation of switchgear[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(3): 6-11. [5] Frei P U, Weichert H O. Advanced thermal simulation of a circuit breaker[C]. Proceedings of 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, 2004: 104-110. [6] 纽春萍, 陈德桂, 刘颖异, 等. 计及主回路和电磁系统发热的交流接触器竖直热分析[J]. 中国电机工程学报, 2007, 27(15): 53-58. [7] 杨世铭, 陶文铨. 传热学[M]. 3版. 北京: 高等教育出版社, 2005. [8] 郑必成. 继电器瞬态温度场仿真计算及实验[D]. 武汉: 华中科技大学, 2008. [9] 梁盼望. 反复短时工作制下电磁继电器瞬态温度场计算(内部研究报告)[R]. 武汉: 华中科技大学电气与电子工程学院, 2009.6. [10] GB988—82低压电器基本试验方法[S]. 国家标准局, 1982.
2011, Vol. 26 
