Abstract:Compared with traditional Si devices, GaN devices have the advantages of high voltage and high temperature resistance, small on-resistance and low switching loss. However, the dynamic on-resistance of GaN devices has become the main reliability problem that limits their large-scale application. Based on the affecting factor analysis of the dynamic on-resistance, this paper proposes a comprehensive test platform and test method. The dynamic on-resistance under several affecting factors of three GaN devices with same voltage/current level and different structures is tested. The proportion of affecting factors and the change of dynamic on-resistance are analyzed. The mechanism analysis is verified by being compared with experimental results. Finally, the application methods of GaN devices with low dynamic on-resistance are given. The proposed test platform covers most of the affecting factors of dynamic on-resistance in practical applications. The experimental results show that the dynamic on-resistance characteristics and the dominant affecting factors are different with different device structures. Optimizing the dynamic on-resistance from the application level can effectively reduce the conduction loss.
赵方玮, 李艳, 魏超, 张楠, 郑妍璇. GaN器件动态导通电阻精确测试与影响因素分析[J]. 电工技术学报, 2022, 37(18): 4664-4675.
Zhao Fangwei, Li Yan, Wei Chao, Zhang Nan, Zheng Yanxuan. Accurate Measurement of Dynamic on-Resistance of GaN Devices and Affecting Factor Analysis. Transactions of China Electrotechnical Society, 2022, 37(18): 4664-4675.
[1] Millán J, Godignon P, Perpiñà X, et al.A survey of wide bandgap power semiconductor devices[J]. IEEE Transactions on Power Electronics, 2014, 29(5): 2155-2163. [2] Flack T J, Pushpakaran B N, Bayne S B.GaN technology for power electronic applications: a review[J]. Journal of Electronic Materials, 2016, 45(6): 2673-2682. [3] Khalil S G, Hardikar S, Sack S, et al.HV GaN reliability and status[C]//2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA), Blacksburg, VA, 2015: 21-23. [4] Ťapajna M, Hilt O, Bahat-Treidel E, et al.Gate reliability investigation in normally-off P-Type-GaN Cap/AlGaN/GaN HEMTs under forward bias stress[J]. IEEE Electron Device Letters, 2016, 37(4): 385-388. [5] Ueda T. Reliability issues in GaN and SiC power devices[C]//2014 IEEE International Reliability Physics Symposium, Waikoloa, HI, 2014: 3D.4.1-3D.4.6. [6] Wang C H, Ho S Y, Huang J J.Suppression of current collapse in enhancement-mode AlGaN/GaN high electron mobility transistors[J]. IEEE Electron Device Letters, 2016, 37(1): 74-76. [7] Huang Huolin, Liang Y C, Samudra G S, et al.Effects of gate field plates on the surface state related current collapse in AlGaN/GaN HEMTs[J]. IEEE Transa- ctions on Power Electronics, 2014, 29(5): 2164-2173. [8] Lu Bin, Palacios T, Risbud D, et al.Extraction of dynamic on-resistance in GaN transistors: under soft- and hard-switching conditions[C]//2011 IEEE Com- pound Semiconductor Integrated Circuit Symposium (CSICS), Waikoloa, HI, 2011: 1-4. [9] Saito W, Nitta T, Kakiuchi Y, et al.Influence of electric field upon current collapse phenomena and reliability in high voltage GaN-HEMTs[C]//2010 22nd International Symposium on Power Semicon- ductor Devices & IC's (ISPSD), Hiroshima, 2010: 339-342. [10] JEP173 Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices[S]. U.S.A: Jedec Solid State Technology Association, Jan. 2019. [11] Joh J, Tipirneni N, Pendharkar S, et al. Current collapse in GaN heterojunction field effect transistors for high-voltage switching applications[C]//2014 IEEE International Reliability Physics Symposium, Waikoloa, HI, USA, 2014: 6C.5.1-6C.5.4. [12] Hwang I, Kim J, Chong S, et al.Impact of channel hot electrons on current collapse in AlGaN/GaN HEMTs[J]. IEEE Electron Device Letters, 2013, 34(12): 1494-1496. [13] Fabris E, Meneghini M, de Santi C, et al. Hot-electron trapping and hole-induced detrapping in GaN-based GITs and HD-GITs[J]. IEEE Transactions on Electron Devices, 2019, 66(1): 337-342. [14] Li Rui, Wu Xinke, Yang Shu, et al.Dynamic on-state resistance test and evaluation of GaN power devices under hard- and soft-switching conditions by double and multiple pulses[J]. IEEE Transactions on Power Electronics, 2019, 34(2): 1044-1053. [15] Martínez P J, Miaja P F, Maset E, et al.A test circuit for GaN HEMTs dynamic RON characterization in power electronics applications[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019, 7(3): 1456-1464. [16] Li Yuan, Zhao Yuanfu, Huang A Q, et al.Evaluation and analysis of temperature-dependent dynamic RDS,ON of GaN power devices considering high- frequency operation[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(1): 111-123. [17] Cai Yichen, Forsyth A J, Todd R.Impact of GaN HEMT dynamic on-state resistance on converter performance[C]//2017 IEEE Applied Power Elec- tronics Conference and Exposition (APEC), Tampa, FL, 2017: 1689-1694. [18] Chang C Y, Li Yichen, Ren Kailin, et al.An AlGaN/GaN high electron mobility transistor with a built-in light emitter using radiative recombination of two-dimensional electron gas and holes[J]. IEEE Journal of the Electron Devices Society, 2020, 8: 346-349. [19] 梁美, 李艳, 郑琼林, 等. 高速SiC MOSFET开关特性的测试方法[J]. 电工技术学报, 2017, 32(14): 87-95. Liang Mei, Li Yan, Zheng Qionglin, et al.Test method for switching performance of high speed SiC MOSFET[J]. Transactions of China Electrotechnical Society, 2017, 32(14): 87-95. [20] 闫琪, 李艳, 王路. 基于GaN器件的双Buck逆变器共模与损耗[J]. 电工技术学报, 2017, 32(20): 133-141. Yan Qi, Li Yan, Wang Lu.The common-mode characteristics and loss of dual Buck grid-connected inverter based on GaN devices[J]. Transactions of China Electrotechnical Society, 2017, 32(20): 133-141. [21] 何杰, 刘钰山, 毕大强, 等. 电压探头对宽禁带器件高频暂态电压精确测量的影响[J]. 电工技术学报, 2021, 36(2): 362-372. He Jie, Liu Yushan, Bi Daqiang, et al.Impacts of voltage probes for accurate measurement of high- frequency transient voltage of wide-bandgap devices[J]. Transactions of China Electrotechnical Society, 2021, 36(2): 362-372. [22] Badawi N, Dieckerhoff S.A new method for dynamic RON extraction of GaN power HEMTs[C]//Pro- ceedings of PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 2015: 1-6.