电工技术学报  2018, Vol. 33 Issue (3): 670-679    DOI: 10.19595/j.cnki.1000-6753.tces.161667
电工理论与新技术 |
内置电路板的复杂多腔体电磁串扰屏蔽效能的解析研究
郝建红, 公延飞, 蒋璐行, 范杰清
华北电力大学电气与电子工程学院北京 102206
Analytical Formulation for the Shielding Effectiveness of Electromagnetic Crosstalk from a Complex Multiple Enclosures with Inner Circuit Board
Hao Jianhong, Gong Yanfei, JiangLuhang, Fan Jieqing
School of Electrical and Electronic Engineering North China Electric Power University Beijing 102206 China
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摘要 在复杂多腔体的金属屏蔽体中,紧凑相邻腔体之间的电磁串扰属于近场干扰,会对内部放置的电路板或元器件造成影响。利用数值计算方法研究此类问题时,往往需要占用大量的存储资源且计算效率较低。针对此问题,利用电磁拓扑理论和推广的Baum-Liu-Tesche(BLT)方程,考虑一个内置电路板的多腔金属屏蔽体,其相邻腔体之间金属隔板上的开孔用导电材料进行封堵,针对相邻空间的近场电磁串扰,构建计算屏蔽效能的解析模型。利用该模型分析导电材料电导率大小、激励源位置、电路板厚度和位置以及数量对屏蔽效能的影响。研究结果表明,该模型的计算结果与CST的仿真结果有很好的一致性,验证了本模型的准确性和适用性,相比于数值计算方法不仅节省了计算时间和存储资源,而且还能用于屏蔽效能规律的研究。
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郝建红
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关键词 复杂多腔体BLT方程电路板屏蔽效能导电材料    
Abstract:A metallic shielding enclosure is generally divided into multiple spatial regions where lots of electronic components are distributed in order to decrease the electromagnetic interference from the adjacent space through apertures.An efficient and accurate analytical model has been developed for the electromagnetic crosstalk from multiple rectangular enclosures connected by metallic plates with rectangular apertures covered by conductive sheets where a circuit boardis put in the upper enclosure, and the shielding enclosure is excited by an electric dipole located in the lower enclosure. This model can give prediction for the coupling between the enclosure and the circuit board. The electromagnetic fields from the lower enclosure into the upper one through the covered aperture on the plate are calculated by using the dyadic Green’s function and the boundary condition of a sheet with infinite extension against a plane wave of normal incidence, then the shielding effectiveness (SE) of the target point is calculated in combinationof the electromagnetic topology (EMT) theory and the BLT (Baum-Liu-Tesche) equation.Comparison with the full wave simulation software CST has verified the model over a wide frequency band. Finally, the analytical model is employed to analyze the effect of different factors includingthe conductivity of the conductive sheet, the thickness, the positionand the quantity of the circuitboard, and the position of the electric dipole on the SE of the enclosure. The analytical model can calculate the SE fast and efficiently, and much less memory utilization compared with numerical methods.
Key wordsComplex multiple enclosures    Baum-Liu-Tesche equation    circuit board    shielding effectiveness    conductive sheet   
收稿日期: 2016-10-19      出版日期: 2018-02-26
PACS: TM15  
  M24  
基金资助:国家自然科学基金(61372050)和中央高校基本科研业务费专项基金(2016MS06)资助项目
通讯作者: 公延飞 男,1987年生,博士研究生,研究方向为电工理论与新技术、电力系统电磁兼容。   
作者简介: 郝建红 女,1960年生,教授,博士生导师,研究方向为高功率微波、电磁场理论及混沌控制等。E-mail:jianhonghao@ncepu.edu.cn
引用本文:   
郝建红, 公延飞, 蒋璐行, 范杰清. 内置电路板的复杂多腔体电磁串扰屏蔽效能的解析研究[J]. 电工技术学报, 2018, 33(3): 670-679. Hao Jianhong, Gong Yanfei, JiangLuhang, Fan Jieqing. Analytical Formulation for the Shielding Effectiveness of Electromagnetic Crosstalk from a Complex Multiple Enclosures with Inner Circuit Board. Transactions of China Electrotechnical Society, 2018, 33(3): 670-679.
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https://dgjsxb.ces-transaction.com/CN/10.19595/j.cnki.1000-6753.tces.161667          https://dgjsxb.ces-transaction.com/CN/Y2018/V33/I3/670