电工技术学报  2021, Vol. 36 Issue (12): 2548-2559    DOI: 10.19595/j.cnki.1000-6753.tces.201088
先进功率半导体器件及其封装、集成与应用专题(特约主编:王来利 教授) |
高压SiC器件封装用有机硅弹性体高温宽频介电特性分析
刘东明1, 李学宝1, 顼佳宇1,2, 毛塬1, 赵志斌1
1.新能源电力系统国家重点实验室(华北电力大学) 北京 102206;
2.弗吉尼亚理工大学电气与计算机工程系 黑堡 24060
Analysis of High Temperature Wide Band Dielectric Properties of Organic Silicone Elastomer for High Voltage SiC Device Packaging
Liu Dongming1, Li Xuebao1, Xu Jiayu1,2, Mao Yuan1, Zhao Zhibin1
1. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University Beijing 102206 China;
2. Department of Electrical and Computer Engineering Virginia Tech Blacksburg 24060 USA