基于三维热电耦合有限元模型的IGBT失效形式温度特性研究

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摘要铝引线键合点脱落和焊剂层剥离是IGBT模块两种主要的失效形式。失效形式的失效程度不同, 则IGBT的温度特性也不同。本文给出了一种基于热电耦合有限元模型分析IGBT模块失效形式的失效程度与其温度之间关系的数值模拟方法, 比较了两种失效形式对IGBT性能的影响程度。研究结果表明：在施加相同的载荷条件和边界条件下, 键合点脱落对器件的性能影响程度更高。这种方法及研究结果有助于功率模块设计人员评估IGBT模块失效形式对于模块性能的影响程度、判断失效、制订失效标准以及IGBT模块的优化设计。

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	郑利兵
	韩立
	刘钧
	温旭辉

关键词 ：热电耦合, 有限元, IGBT, 键合点脱落, 焊剂层剥离, 数值模拟

Abstract：Aluminium wire bonding lift-off and solder delamination are the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D electro-thermal coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, and compares the influence degree of two kinds of failure modes to the performance of IGBT module. The results suggest the bonding lift-off has more influence than the solder delamination on the same load and boundary condition. This method and the corresponding results help to evaluate these failure modes how they influence the performance of IGBT, determine the failure, establish the failure standards and find the optimization of structure design.

Key words： Thermal-electric coupling finite element IGBT bonding lift-off solder delamination numerical simulation

收稿日期: 2009-07-21 出版日期: 2014-03-07

PACS:

TN306

基金资助:国家863计划资助项目(2008AA11A108)

作者简介: 郑利兵男, 1972年生, 博士后, 主要研究方向功率模块热设计技术和MEMS设计与集成技术。韩立男, 1970年生, 研究员, 博士生导师, 主要研究方向功率模块的集成技术以及纳米加工技术。

引用本文:

郑利兵, 韩立, 刘钧, 温旭辉. 基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J]. 电工技术学报, 2011, 26(7): 242-246. Zheng Libing, Han Li, Liu Jun, Wen Xuhui. Investigation of the Temperature Character of IGBT Failure Mode Based on 3D Thermal-Electro Coupling FEM. Transactions of China Electrotechnical Society, 2011, 26(7): 242-246.

链接本文:

http://dgjsxb.ces-transaction.com/CN/Y2011/V26/I7/242

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