Intelligent Prediction Method for Thermal Dissipation State of Heatsink in Power Electronic Converter
Fu Heping1, Chen Jie1, Qiu Ruichang1, Liu Zhigang2
1. School of Electrical Engineering Beijing Jiaotong University Beijing 100044 China; 2. Beijing Rail Transit Electrical Engineering Technology Research Center Beijing 100044 China
Abstract In this paper, a steady thermal resistance model and a fluid dynamical model of the heatsink are established to theoretically analyze the mechanism of declining thermal dissipation performance of the heatsink. Secondly, the thermal dissipation state prediction model and scheme based on lumped-parameter model are established. At the same time, the power loss calculation model of the power device is established, which is verified by simulation and experiment. Finally, the change curves of thermal resistance, thermal capacity and thermal time constant of the heatsink under different degrees of fouling are obtained, which provides a new feasible scheme for predicting the thermal dissipation state of the heatsink.
Fu Heping,Chen Jie,Qiu Ruichang等. Intelligent Prediction Method for Thermal Dissipation State of Heatsink in Power Electronic Converter[J]. Transactions of China Electrotechnical Society, 2021, 36(20): 4350-4358.
[1] Andresen M, Ma K, Buticchi G, et al.Junction temperature control for more reliable power elec-tronics[J]. IEEE Transactions on Power Electronics, 2018, 33(1): 765-776. [2] 任磊, 沈茜, 龚春英. 电力电子电路中功率晶体管结温在线测量技术研究现状[J]. 电工技术学报, 2018, 33(8): 1750-1761. Ren Lei, Shen Qian, Gong Chunying.Current junction temperature online measurement techniques of power transistors in power electronic converters[J]. Transactions of China Electrotechnical Society, 2018, 33(8): 1750-1761. [3] 万萌, 应展烽, 张伟. 分立型功率MOSFET结温估计的非线性热网络模型和参数辨识方法[J]. 电工技术学报, 2019, 34(12): 2477-2488. Wan Meng, Ying Zhanfeng, Zhang Wei.Nonlinear thermal network model and parameter identification method for junction temperature estimation of discrete power MOSFET[J]. Transactions of China Electrotechnical Society, 2019, 34(12): 2477-2488. [4] Choi U, Blaabjerg F, Lee K.Study and handling methods of power IGBT module failures in power electronic converter systems[J]. IEEE Transactions on Power Electronics, 2015, 30(5): 2517-2533. [5] 姚芳, 胡洋, 李铮, 等. 基于结温监测的风电IGBT热安全性和寿命耗损研究[J]. 电工技术学报, 2018, 33(9): 2024-2033. Yao Fang, Hu Yang, Li Zheng, et al.Study on thermal safety and lifetime consumption of IGBT in wind power converters based on junction temperature monitoring[J]. Transactions of China Electrotechnical Society, 2018, 33(9): 2024-2033. [6] 彭英舟, 周雒维, 张晏铭, 等. 基于键合线等效电阻的IGBT 模块老化失效研究[J]. 电工技术学报, 2017, 32(20): 117-132. Peng Yingzhou, Zhou Luowei, Zhang Yanming, et al.Study of IGBT module aging failure base on bond wire equivalent resistance[J]. Transactions of China Electrotechnical Society, 2017, 32(20): 117-132. [7] 李辉, 胡姚刚, 刘盛权, 等. 计及焊层疲劳影响的风电变流器 IGBT 模块热分析及改进热网络模型[J]. 电工技术学报, 2017, 32(13): 80-87. Li Hui, Hu Yaogang, Liu Shengquan, et al.Thermal analysis and improved thermal network model of IGBT module for wind power converter considering solder fatigue effects[J]. Transactions of China Electrotechnical Society, 2017, 32(13): 80-87. [8] Laloya E, Lucia Ó, Sarnago H, et al.Heat mana-gement in power converters: from state of the art to future ultrahigh efficiency systems[J]. IEEE Transa-ctions on Power Electronics, 2016, 31(11): 7896-7908. [9] Wu Tong, Wang Zhiqiang, Ozpineci B, et al.Automated heatsink optimization for aircooled power semiconductor modules[J]. IEEE Transactions on Power Electronics, 2019, 34(6): 5027-5031. [10] Montgomery S W.Fouling of high density heat sinks: theoretical origins and numerical analysis[C]//Thermal Measurement and Management, Eighteenth Annual IEEE Symposium, San Jose, CA, USA, 2002: 132-136. [11] Moore D A.Characterization of fiber accumulation fouling in fine pitched heat sinks[C]//25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, USA, 2009: 279-284. [12] Nabi A, Rodgers P, Barcohen A.Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling[C]//Twenty-Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Dallas, TX, 2006: 2-9. [13] Ma Ke, He Ning, Liserre M, et al.Frequency-domain thermal modeling and characterization of power semiconductor devices[J]. IEEE Transactions on Power Electronics, 2016, 31(10): 7183-7193. [14] Gammeter C, Krismer F, Kolar J W.Weight optimization of a cooling system composed of fan and extruded-fin heat sink[J]. IEEE Transactions on Industry Applications, 2015, 51(1): 509-520. [15] 宋静文. 大功率光伏逆变器损耗模型的研究[D]. 成都: 西南交通大学, 2013. [16] 李洋. 双馈风电变流器功率模块IGBT结温波动抑制策略研究[D]. 重庆: 重庆大学, 2016.
2021, Vol. 36 
