|
|
Temperature Characteristioc and Electric-Thermal Model of IGBT Switching Transient |
Tang Yong, Wang Bo, Chen Ming |
National Key Laboratory for Vessel Integrated Power System Technology, Naval University of Engineering Wuhan 430033 China |
|
|
Abstract Material characteristics of semiconductor depend on temperature, thus performance and switching transient of silicon IGBT is greatly affected by temperature. Through the experiments of switching transient under different temperature, it is found that IGBT’s turn-on and turn-off transients have different temperature characteristics. According to the analysis of the experimental phenomenon, a conclusion is obtained that the temperature characteristic of switching transient is mainly affected by carrier life. Thereby, based on the existing methods, an improved eletro-thermal model of IGBT is proposed. Then the model is used to simulate the turn-off tail current and the whole switching transient of IGBT. With the comparison between simulation and experiment waveforms, the above conclusion is validated and the model is also approved to be accurate.
|
Received: 30 March 2011
Published: 20 March 2014
|
|
|
|
|
[1] 胡建辉, 李锦庚, 邹继斌. 变频器中的IGBT模块损耗计算及散热系统设计[J]. 电工技术学报, 2009, 24(3): 159-163. Hu Jianhui, Li Jingeng, Zou Jibin. Losses calculation of IGBT module and heat dissipation system design of inverters[J]. Transactions of China Electrotechnical Society, 2009, 24(3): 159-163. [2] 梅杨, 孙凯, 黄立培. 基于逆阻式IGBT的三相/单相矩阵式变换器[J]. 电工技术学报, 2007, 22(3): 91-95. Mei Yang, Sun Kai, Huang Lipei. Three-phase to single-phase matrix converter using RB-IGBT[J]. Transactions of China Electrotechnical Society, 2007, 22(3): 91-95. [3] 孟进, 马伟明, 张磊, 等. 基于IGBT开关暂态过程建模的功率变流器电磁干扰频谱估计[J]. 中国电机工程学报, 2005, 25(20) : 16-20. Meng Jin, Ma Weiming, Zhang Lei, et al. EMI evaluation of power converters considering IGBT switching transient modeling[J]. Proceedings of the CSEE, 2005, 25(20): 16-20. [4] Majumdar G, Minato T. Recent and future IGBT evolution[C]. Power Conversion Conference , Nagoya, Japan , 2007: 355-359. [5] Otsuki M, Onozawa Y, Yoshiwatari S, et al. 1 200V FS-IGBT module with enhanced dynamic clamping capability[C]. Proceedings of 2004 International Symposium on Power Semiconductor Devices and ICs. Kitakyushu, Japan, 2004: 339-342. [6] Ruething H, Umbach F, Hellmund O, et al. 600V-IGBT3: trench field Stop technology in 70pm ultra thin wafer technology[C]. International Symposium on Power Semiconductor Devices and ICs. Cambridge, UK, 2003: 14-17. [7] 蔡慧, 赵荣祥, 陈辉明, 等. 倍频式IGBT高频感应加热电源的研究[J]. 中国电机工程学报, 2006, 26(2): 154-158. Cai Hui, Zhao Rongxiang, Chen Huiming, et al. Study on multiple-frequency IGBT high frequency power supply for induction heating[J]. Pcoceeding of the CSEE, 2006, 26(2): 154-158(in Chinese). [8] 刘恩科, 朱秉升, 罗晋生. 半导体物理学[M]. 北京: 电子工业出版社, 1996. [9] 陈治明, 李守智. 宽禁带半导体电力电子器件及其应用[M]. 北京: 机械工业出版社, 2009. [10] Palmer P R, Santi E, Hudgins J L. Circuit simulator models for the diode and IGBT with full temperature dependent features[J]. IEEE Transactions on Power Electronics, 2003, 18(5): 1220-1229. [11] Lim D J, Pulko S H. Characterisation of heat spreader materials for pulsed IGBT operation[J]. IET Circuits Devices Syst, 2007, 1(2): 126-136. [12] 方健, 吴超, 乔明, 等. 局域寿命控制NPT -GBT瞬态模型[J]. 半导体学报, 2006, 27(6): 1078-1083. Fang Jian, Wu Chao , Qiao Ming, et al. A dynamic state model of NPT IGBT with localized lifetime control[J]. Chinese Journal of Semiconductor, 2006, 27(6): 1078-1083. [13] Kwang H O, Jaegil L, Kyuhyun L, et al. A simulation study on novel field stop IGBTs using super junction[J]. IEEE Transactions on Electron Devices, 2006, 53(4): 884-890. [14] Angus T Bryant, Liqing Lu, Enrico Santi, et al. Modeling of IGBT resistive and inductive turn-on behavior[J]. IEEE Transactions on Industry Application, 2008, 44(3): 904-914. [15] Hefner A R. A dynamic electro-thermal model for the IGBT[J]. IEEE Transactions on Industry Application, 1994, 30(2): 394-405. [16] Rosu M, Wu X, Cendes Z, et al. A novel electrothermal IGBT modeling approach for circuit simulation design[C]. Applied Power Electronics Conference and Exposition, Austin, USA, 2008: 1685-1689. [17] Alberto C, Emmanuel B, Mauro C, et al. Full electro- thermal model of a 6. 5kV field-stop IGBT module[C]. Power Electronics Specialists Conference. Rhode, USA, 2008: 392-397. [18] 唐勇, 陈明, 汪波, 等. 场终止型IGBT开关瞬态模型[J]. 中国电机工程学报, 2010, 31(30): 54-60. Tang Yong, Chen Ming, Wang Bo. Switching transient model of field-stop IGBT[J]. Proceedings of the CSEE, 2010, 31(30): 54-60. [19] 唐勇, 胡安, 陈明. IGBT栅极特性与参数提取[J]. 电工技术学报, 2009, 24(7): 76-80. Tang Yong, Hu An, Chen Ming. IGBT gate characteristics and parameter extraction methods[J]. Transactions of China Electrotechnical Society, 2009, 24(7): 76-80. [20] Tang Yong, Chen Ming, Wang Bo. New methods for extracting field-stop IGBT model parameters by electrical measurements[C]. IEEE International Symposium on Industrial Electronics, Korea, 2009: 1546-1551. [21] Tang Yong, Chen Ming, Wang Bo. An improved method for IGBT base excess carrier lifetime extraction[C]. Applied Superconductivity and Electro- magnetic Devices, 2009: 206 - 210. [22] Hefner A R. Analytical modeling of device-circuit interactions for the power insulated gate bipolar transistor(IGBT)[J]. IEEE Transactions on Industry Applications, 1990, 26(6): 995-1005. [23] Hefner A R, Member S. Modeling buffer layer IGBT’s for circuit simulation[J]. IEEE Transactions on Power Electronics, 1995, 10(2): 111-123. |
|
|
|