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| Comparative Analysis DC and AC Power Cycling Test Methods Considering Typical Operating Conditions for IGBT Devices |
| Wang Hao1, Lai Wei1, Wu Yunjie1, Li Hui1, He Yunze2 |
1. State Key Laboratory of Power Transmission Equipment Technology School of Electrical Engineering Chongqing University Chongqing 400044 China;
2. College of Electrical and Information Engineering Hunan University Changsha 410082 China |
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Abstract As key components of converters, power devices play a critical role in energy conversion and electric power control. However, due to the increasing power density and the complex operating environments, reliability issues of these devices have become more prominent. Device reliability evaluation depends on the online acquisition of aging parameters through power cycling tests and failure mechanism analysis. However, the existing DC power cycling tests show significant discrepancies from real-world operating stress conditions, resulting in uncertain failure mechanisms and data accuracy. Therefore, this paper addresses a widely concerning issue in the industry: whether it is necessary to consider real-world operating stress when conducting IGBT power cycling tests. It presents a comparative analysis of the differences between welded and press-pack IGBT devices under DC and AC power cycling tests, which is crucial for assessing the actual service reliability of power devices. The main research contents include the following aspects.
(1) Failure mechanism and data comparison for welded IGBT Devices under DC and AC power cycling tests for medium- and low-voltage converters. An experimental platform for AC power cycling, simulating typical conditions of wind power converters with adjustable frequency parameters and thermal load conditions, was established. Accelerated aging tests were performed to analyze the impact of frequency parameters on the failure evolution and lifetime of IGBT modules, and the results were compared with traditional DC power cycling tests. Experimental results show that different power cycling methods do not affect the failure modes of welded IGBTs, with packaging degradation being the primary failure mechanism. However, DC power cycling with DC excitation, which differs significantly from the actual operating conditions and neglects switching losses due to switching frequencies, makes it difficult to analyze the impact of output frequency on device reliability based on DC aging power cycling. It, in turn, affects the accuracy of device lifetime modeling and remaining lifetime prediction.
(2) Failure mode and data comparison for press-pack IGBT devices under DC and AC power cycling tests for flexible DC converter valve applications. For flexible DC converter valve applications, failure mode and data were compared for press-pack IGBT devices under DC and AC power cycling tests. An AC power cycling experimental platform was established to replicate the MMC submodule operating conditions, including capacitor voltage, arm current, and switching signals. Aging characteristics and microscopic morphological evolution were observed to analyze the long-term aging failure mechanisms of press-pack IGBT devices under MMC operating conditions. The identified failure modes were gate leakage current-induced open-circuit failure and avalanche breakdown-induced short-circuit failure. A comparison between AC and DC power cycling test results showed significant differences in failure modes. Under constant DC conditions, the device exhibited only open-circuit failure, whereas under AC conditions, both open-circuit and short-circuit failure modes occurred. It indicates that testing methods that do not reflect real operating conditions are insufficient to effectively characterize the failure process of press-pack IGBTs. Furthermore, applying a device lifetime model based on DC conditions to actual long-term reliability operations in engineering applications would overestimate the remaining life of the device, ultimately leading to increased system failure rates.
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Received: 16 October 2024
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2025, Vol. 40 
