REBCO高温超导多芯带材的制备技术及性能研究进展

doi:10.19595/j.cnki.1000-6753.tces.231869

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Abstract

The second generation of high-temperature superconducting REBCO tapes has become the focus due to their excellent critical current density, high upper critical field, and high critical transition temperature. At present, it has been gradually applied in important fields such as electric power transportation, scientific instruments, fusion energy and other high-tech fields. However, large AC loss and obvious shielding current effect have been caused by the high aspect ratio (the dimensional ratio of the width to the thickness of the superconducting tape) of REBCO superconducting tapes in practical application. To mitigate the effects caused by the aspect ratio, researchers have adopted various fabrication techniques to divide the superconducting layer within the tape into multiple parallel and extremely narrow "filaments", thus modifying the REBCO tape into a REBCO "multifilamentary tape". This subdivision technique ensures that each individual superconducting filament has a smaller width, effectively reducing the AC losses caused by an excessive width-to-thickness ratio, as well as diminishing the shielding current effect. Therefore, the preparation of REBCO high-temperature superconducting multifilamentary tapes using various techniques has become a focal point of interest among researchers in this field both domestically and internationally.
This article systematically reviews the research progress in the methods of preparing REBCO multi-filamentary tapes and related performance, both domestically and internationally. Based on current fabrication technologies, the first discusses techniques for modifying commercial REBCO tapes into multi-filamentary structures, including laser cutting, mechanical cutting, and chemical etching techniques. Laser cutting technology is noted for its high precision and stability, but it may introduce thermal stress during the cutting process, potentially affecting the superconducting properties of the tape. Mechanical cutting is a simple fabrication process, yet it may cause mechanical damage to the superconducting layer within the tape. Chemical etching presents challenges in controlling the width of the grooves during the etching process and environmental contamination. Subsequently, the article delves into the direct forming technologies for REBCO multi-core tapes, which include inkjet printing, mechanical scribing, and two-stage profile substrate techniques. Although inkjet printing technology can produce multi-core tapes with complex patterns, it is necessary to consider the issue of weak links at the grain boundaries of the REBCO superconducting material. Mechanical scribing, a simple and cost-effective process, requires precise control of the scribe thickness to minimize the diffusion of substrate components into the REBCO superconducting layer, which could lead to impurity doping or chemical reactions, thereby affecting superconducting performance. The two-stage profile substrate technique employs chemical solutions to etch micron-sized concave profiles, creating regular and uniform multi-filamentary structures.
Nevertheless, the fabrication technology of REBCO multi-filamentary tapes still faces many challenges, such as how to balance the cost and efficiency of the preparation process. Efforts are needed to further enhance the current-carrying capacity and mechanical properties of the tapes, as well as to ensure their stability when applied in extreme environments. Furthermore, the impact of micro-cracks and defects that may occur during cutting or etching processes on the superconducting performance needs to be addressed.

Key words： REBCO high-temperature superconducting multifilamentary tape critical current fabrication technology AC loss shielding current effect

Received: 08 November 2023

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	Li Zuoguang
	Zhang Zhan
	Wei Shaoqing
	Qin Jinggang
	Zhou Chao

Cite this article:

Li Zuoguang,Zhang Zhan,Wei Shaoqing等. Research Progress on Fabrication Technology and Properties of REBCO High Temperature Superconducting Multifilamentary Tape[J]. Transactions of China Electrotechnical Society, 0, (): 231869-231869.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.231869 OR https://dgjsxb.ces-transaction.com/EN/Y0/V/I/231869

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