高压大功率IGBT器件封装用有机硅凝胶的制备工艺及耐电性

doi:10.19595/j.cnki.1000-6753.tces.200099

摘要
图/表
参考文献
相关文章 (6)

全文: PDF (140457 KB) HTML
输出: BibTeX | EndNote (RIS)

摘要

有机硅凝胶凭借其优异的电绝缘和机械性能,广泛应用于IGBT器件的封装绝缘。该文详细介绍有机硅凝胶的制备工艺,改进了脱气曲线,解决传统工艺制备的样品在高温下出现气泡的问题。此外,考虑到IGBT器件在运行过程中产生大量的热量,热量作为副产物影响绝缘材料的性能,该文使用改进的脱气曲线制备了有机硅凝胶样品,通过实验得出不同温度下样品击穿电压的韦伯分布,获得温度对有机硅凝胶工频电击穿的影响规律并分析影响机制。该研究将为硅凝胶在高压IGBT功率器件的封装设计中提供重要的实用信息。

	服务

	把本文推荐给朋友
	加入我的书架
	加入引用管理器
	E-mail Alert
	RSS
	作者相关文章
	顼佳宇
	李学宝
	崔翔
	毛塬
	赵志斌

关键词 ：有机硅凝胶, 改进脱气曲线, 工频电击穿特性, 热性能, 自由体积理论

Abstract：

Silicone gel is a prevailing material for the encapsulation of IGBT power modules due to its excellent electrical insulation and mechanical properties. In the paper, the preparation process of silicone gel is elaborated. The improved vacuum degassing process is proposed, which can solve the problem that the bubbles are always generated in silicone gel at higher temperatures. In addition, the heat as a byproduct generated during the running of modules will result in temperature changes of the encapsulant. Therefore, the Weibull distributions of silicone gel sample, prepared in accordance with the improved degassing method, are measured under different temperatures. Then, the influence mechanism of temperature on the breakdown characteristic of silicone gel is analyzed. This paper can provide the practical information for the design of encapsulation in high voltage IGBT power modules.

Key words： Silicone gel improved degassing process breakdown characteristic under power frequency thermal performance free volume theory

收稿日期: 2020-02-04

PACS:

TM211

基金资助:

国家自然基金与国家智能电网联合基金（U1766219）和中央高校基金（2019QN120）资助项目

通讯作者: 李学宝男,1988年生,博士,副教授,研究方向为电力系统的电磁环境和电磁兼容、高压设备绝缘。E-mail: lxb08357@ncepu.edu.cn

作者简介: 顼佳宇女,1992年生,博士研究生,研究方向为高压设备绝缘、高压大功率电力电子器件封装技术、有机硅凝胶绝缘能力评估。E-mail: ncepuxjy@163.com

引用本文:

顼佳宇, 李学宝, 崔翔, 毛塬, 赵志斌. 高压大功率IGBT器件封装用有机硅凝胶的制备工艺及耐电性[J]. 电工技术学报, 2021, 36(2): 352-361. Xu Jiayu, Li Xuebao, Cui Xiang, Mao Yuan, Zhao Zhibin. Preparation Process and Breakdown Properties of Silicone Gel Used for the Encapsulation of IGBT Power Modules. Transactions of China Electrotechnical Society, 2021, 36(2): 352-361.

链接本文:

https://dgjsxb.ces-transaction.com/CN/10.19595/j.cnki.1000-6753.tces.200099 https://dgjsxb.ces-transaction.com/CN/Y2021/V36/I2/352

[1] 王坤山, 谢立军, 金锐. IGBT技术进展及其在柔性直流输电中的应用[J]. 电力系统自动化, 2016, 40(6): 139-143.
Wang Kunshan, Xie Lijun, Jin Rui.Recent deve- lopment and application prospects of IGBT in flexible HVDC power system[J]. Automation of Electric Power Systems, 2016, 40(6): 139-143.
[2] 赵志斌, 邓二平, 张朋, 等. 换流阀用与直流断路器用压接型IGBT器件差异分析[J]. 电工技术学报, 2017, 32(19): 125-133.
Zhao Zhibin, Deng Erping, Zhang Peng, et al.Review of the difference between the press pack IGBT using for converter valve and for DC breaker[J]. Transa- ctions of China Electrotechnical Society, 2017, 32(19): 125-133.
[3] 刘向向, 李志刚, 姚芳. 不同工作模式下的IGBT模块瞬态热特性退化分析[J]. 电工技术学报, 2019, 34(增刊2): 509-517.
Liu Xiangxiang, Li Zhigang, Yao Fang.Analysis of transient thermal degradation of IGBT modules in different operating modes[J]. Transactions of China Electrotechnical Society, 2019, 34(S2): 509-517.
[4] 丁婷, 陈磊, 唐毅平, 等. 新型大功率IGBT用硅凝胶的制备及其应用性研究[J]. 绝缘材料, 2014, 47(2): 52-55.
Ding Ting, Chen Lei, Tang Yiping, et al.Preparation and application research of novel silicone gel for high-power IGBT[J]. Insulating Materials, 2014, 47(2): 52-55.
[5] Morshed M, Islam A, Roose T, et al.Control of partial discharge with high temperature insulating polymer for high voltage IGBT module application[C]// International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, VDE, 2018: 1-6.
[6] 王惠中. 生产工艺对复合材料最终性能的影响[J]. 世界橡胶工业, 2017, 44(10): 21-25.
Wang Huizhong.Effect of production process on final properties of composite materials[J]. World Rubber Industry, 2017, 44(10): 21-25.
[7] 张浩. 电子灌封胶的制备及性能研究[D]. 合肥: 合肥工业大学, 2012.
[8] 丁娉, 赵慧宇, 姜其斌, 等. IGBT用双组分加成型有机硅凝胶的国产化研究[J]. 特种橡胶制品, 2013, 34(3): 31-33.
Ding Ting, Zhao Huiyu, Jiang Qibin, et al.Localization research on the addition type of silicone gel used in IGBT[J]. Special Purpose Rubber Products, 2013, 34(3): 31-33.
[9] 冯传均, 王传伟, 戴文峰, 等. 高压模块的有机硅凝胶灌封工艺设计与改进[J]. 电子工艺技术, 2015, 36(1): 51-54.
Fen Chuanjun, Wang Chuanwei, Dai Wenfeng, et al.Silicone gel encapsulation process design and improvement of high voltage module[J]. Electronics Process Technology, 2015, 36(1): 51-54.
[10] 陈铮铮, 程子霞, 周远翔, 等. 气泡及气隙裂纹缺陷对硅橡胶电树枝起始特性的影响[J]. 高电压技术, 2009, 35(10): 2416-2420.
Chen Zhengzheng, Cheng Zixia, Zhou Yuanxiang, et al.Influence of gas void and gas crack defects on electrical tree initiation in silicone rubber[J]. High Voltage Engineering, 2009, 35(10): 2416-2420.
[11] Sato M, Kumada A, Hidaka K, et al.Void-free encapsulation technique for semiconductor devices using silicone gel[C]//Annual Report Conference on Electrical Insulation and Dielectric Phenomena, Shenzhen, China, 2013: 921-924.
[12] 穆龙, 兰生, 黄明亮. 不同类型电热应力下变压器油纸绝缘老化特性实验研究[J]. 电气技术, 2018, 19(12): 29-34.
Mu Long, Lan Sheng, Huang Mingliang.Study on aging characteristics of transformer oil-paper insulation under different types of electro-thermal stress[J]. Electrical Engineering, 2018, 19(12): 29-34.
[13] Finis G, Claudi A.On the dielectric breakdown behavior of silicone gel under various stress conditions[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2007, 14(2): 487-494.
[14] Do M T, Auge J L, Lesaint O.Breakdown field in silicone gel under needle-plane geometry[C]//Inter- national Symposium on Electrical Insulating Materials, Mie, Japan, 2008: 222-225.
[15] Banaszczyk J, Adamczyl B.Dielectric strength measurements of silicone gel[C]//Progress in Applied Electrical Engineering, Koscielisko-Zakopane, Poland, 2016: 1-4.
[16] 陈民铀, 高兵, 杨帆, 等. 基于电-热-机械应力多物理场的IGBT焊料层健康状态研究[J]. 电工技术学报, 2015, 30(20): 252-260.
Chen Minyou, Gao Bing, Yang Fan, et al.Healthy evaluation on IGBT solder based on electro thermal mechanical analysis[J]. Transactions of China Elec- trotechnical Society, 2015, 30(20): 252-260.
[17] Yao Yiying, Lu Guoquan, Boroyevuch D, et al.Survey of high-temperature polymeric encapsulants for power electronics packaging[J]. IEEE Transa- ctions on Components, Packaging and Manufacturing Technology, 2015, 5(2): 168-181.
[18] 刘辉, 陈新, 肖雨, 等. 室温固化双组分硅凝胶的制备及其性能[J]. 华东理工大学学报: 自然科学版, 2017, 43(1): 66-69.
Liu Hui, Chen Xin, Xiao Yu, et al.Preparation and properties of two component silicone gel cured at room temperature[J]. Journal of East China Univer- sity: Science and Technology, 2017, 43(1): 66-69.
[19] 张靖楠. 硅凝胶灌注高压电源工艺研制及应用[C]//中国电子学会生产技术学分会第五届化学工艺专业委员会年会, 西安, 中国, 2000.
[20] 柯其宁, 代志鹏, 陈琛, 等. 铂催化硅氢加成反应进展[J]. 化工进展, 2020, 39(3): 992-999.
Ke Qining, Dai Zhipeng, Chen Chen, et al.Progress in platinum-catalyzed hydrosilylation reaction[J]. Chemical Industry and Engineering Progress, 2020, 39(3): 992-999.
[21] 张建伟, 杨坤涛, 宗思光, 等. 水中气泡运动特性及测量[J]. 红外技术, 2011, 33(4): 219-225.
Zhang Jianwei, Yang Kuntao, Zong Siguang, et al.Investigation and measurement of bubble characte- ristic in water[J]. Infrared Technology, 2011, 33(4): 219-225.
[22] 张淑君. 气泡动力学特性的三维数值模拟研究[D]. 南京: 河海大学, 2006.
[23] 许玲丽. 单气泡运动特性分析及曳力模型修正[D]. 徐州: 中国矿业大学, 2015.
[24] International electrotechnical commission. insulating materials-test methods for electric strength. part 1: test at power frequencies: IEC 60243-1[S]. Inter- national Electrotechnical commission, Czech Institute for Standardization, 2013.
[25] 高铭泽, 赵洪, 吕洪雷, 等. EBS/PP复合材料抗水树枝性能研究[J]. 电工技术学报, 2019, 34(24): 5252-5261.
Gao Mingze, Zhao Hong, Lü Honglei, et al.Study on anti-water-treeing performance of SEBS/PP com- posites[J]. Transactions of China Electrotechnical Society, 2019, 34(24): 5252-5261.
[26] 曹雯, 宋倩文, 申巍, 等. 环氧/纸复合材料直流耐压寿命模型的估计方法[J]. 电工技术学报, 2019, 34(18): 3750-3758.
Cao Wen, Song Qianwen, Shen Wei, et al.Estimation methods of DC withstand voltage lifetime model for epoxy/paper composites[J]. Transactions of China Electrotechnical Society, 2019, 34(18): 3750-3758.
[27] Fabiani D, Simoni L.Discussion on application of the Weibull distribution to electrical breakdown of insulating materials[J]. IEEE Transactions on Die- lectrics and Electrical Insulation, 2005, 12(1): 11-16.
[28] 谢从珍, 曾磊磊, 甘永叶, 等. 基于热重红外联用的复合绝缘子芯棒热解特性研究[J]. 电工技术学报, 2018, 33(增刊1): 227-233.
Xie Congzhen, Zeng Leilei, Gan Yongye, et al.Study on pyrolysis characteristics of fiber reinforced plastic rod of composite insulators based on TG-FTIR analysis[J]. Transactions of China Electrotechnical Society, 2018, 33(S1): 227-233.
[29] 杨万泰. 聚合物材料表征与测试[M]. 北京: 中国轻工业出版, 2008.
[30] Fava R A.Electric breakdown in polymers[M]. Elsevier: Treatise on Materials Science & Tech- nology, 1977.
[31] 王威望, 李盛涛, 刘文凤. 聚合物纳米复合电介质的击穿性能[J]. 电工技术学报, 2017, 32(16): 26-36.
Wang Weiwang, Li Shengtao, Liu Wenfeng.Dielectric breakdown of polymer nanocomposites[J]. Transactions of China Electrotechnical Society, 2017, 32(16): 26-36.
[32] 钱恺羽, 苏鹏飞, 吴建东, 等. 不同温度下高压直流电缆绝缘击穿场强的厚度效应[J]. 中国电机工程学报, 2018, 38(24): 7121-7130, 7438.
Qian Kaiyu, Su Pengfei, Wu Jiandong, et al.The effect of thickness on breakdown strength in high voltage direct current cable insulation at different temperatures[J]. Proceedings of the CSEE, 2018, 38(24): 7121-7130, 7438.