电工技术学报  2021, Vol. 36 Issue (2): 352-361    DOI: 10.19595/j.cnki.1000-6753.tces.200099
电力电子学 |
高压大功率IGBT器件封装用有机硅凝胶的制备工艺及耐电性
顼佳宇1,2, 李学宝1, 崔翔1, 毛塬1, 赵志斌1
1.新能源电力系统国家重点实验室(华北电力大学)北京 102206;
2.弗吉尼亚理工大学电气与计算机工程系 黑堡 24060
Preparation Process and Breakdown Properties of Silicone Gel Used for the Encapsulation of IGBT Power Modules
Xu Jiayu1,2, Li Xuebao1, Cui Xiang1, Mao Yuan1, Zhao Zhibin1
1. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University Beijing 102206 China;
2. Department of Electrical and Computer Engineering Virginia Tech Blacksburg 24060 USA
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摘要 

有机硅凝胶凭借其优异的电绝缘和机械性能,广泛应用于IGBT器件的封装绝缘。该文详细介绍有机硅凝胶的制备工艺,改进了脱气曲线,解决传统工艺制备的样品在高温下出现气泡的问题。此外,考虑到IGBT器件在运行过程中产生大量的热量,热量作为副产物影响绝缘材料的性能,该文使用改进的脱气曲线制备了有机硅凝胶样品,通过实验得出不同温度下样品击穿电压的韦伯分布,获得温度对有机硅凝胶工频电击穿的影响规律并分析影响机制。该研究将为硅凝胶在高压IGBT功率器件的封装设计中提供重要的实用信息。

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关键词 有机硅凝胶改进脱气曲线工频电击穿特性热性能自由体积理论    
Abstract

Silicone gel is a prevailing material for the encapsulation of IGBT power modules due to its excellent electrical insulation and mechanical properties. In the paper, the preparation process of silicone gel is elaborated. The improved vacuum degassing process is proposed, which can solve the problem that the bubbles are always generated in silicone gel at higher temperatures. In addition, the heat as a byproduct generated during the running of modules will result in temperature changes of the encapsulant. Therefore, the Weibull distributions of silicone gel sample, prepared in accordance with the improved degassing method, are measured under different temperatures. Then, the influence mechanism of temperature on the breakdown characteristic of silicone gel is analyzed. This paper can provide the practical information for the design of encapsulation in high voltage IGBT power modules.

Key wordsSilicone gel    improved degassing process    breakdown characteristic under power frequency    thermal performance    free volume theory   
收稿日期: 2020-02-04     
PACS: TM211  
基金资助:

国家自然基金与国家智能电网联合基金(U1766219)和中央高校基金(2019QN120)资助项目

通讯作者: 李学宝 男,1988年生,博士,副教授,研究方向为电力系统的电磁环境和电磁兼容、高压设备绝缘。E-mail: lxb08357@ncepu.edu.cn   
作者简介: 顼佳宇 女,1992年生,博士研究生,研究方向为高压设备绝缘、高压大功率电力电子器件封装技术、有机硅凝胶绝缘能力评估。E-mail: ncepuxjy@163.com
引用本文:   
顼佳宇, 李学宝, 崔翔, 毛塬, 赵志斌. 高压大功率IGBT器件封装用有机硅凝胶的制备工艺及耐电性[J]. 电工技术学报, 2021, 36(2): 352-361. Xu Jiayu, Li Xuebao, Cui Xiang, Mao Yuan, Zhao Zhibin. Preparation Process and Breakdown Properties of Silicone Gel Used for the Encapsulation of IGBT Power Modules. Transactions of China Electrotechnical Society, 2021, 36(2): 352-361.
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https://dgjsxb.ces-transaction.com/CN/10.19595/j.cnki.1000-6753.tces.200099          https://dgjsxb.ces-transaction.com/CN/Y2021/V36/I2/352