Abstract：In this paper,to study the effect of soluble and insoluble particles of typical dust on the relative humidity on PCB surface,the comb pattern PCB covered by particles is adopted as test samples under temperature humidity bias (THB) conditions.The surface insulation resistance between circuits on PCB is monitored.The effect of compositions and solubility of soluble particles on the critical relative humidity is investigated.The reasons of the insoluble particles,under the action of capillary,changing the desorption of water from PCB surface and keeping high humidity on PCB surface for longer time are researched.The electrochemical migration mechanism of PCB caused by dust contamination is also discussed.
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2015, Vol. 30 
