Abstract:In order to reduce the size of EMI filter and improve the power density of switch mode power supplies, a stacked-type interleaved planar passive integrated EMI filter structure is proposed in this paper. In this structure, the common-mode chokes, differential-mode inductors, common-mode capacitors and differential-mode capacitors are integrated into one unit. With this structure, the problem which large capacitor is hard to integrated is resolved, and the equivalent series resistance(ESR) and equivalent series inductance(ESL) of the integrated capacitor are minimized. The high-frequency common-mode equivalent circuit model is established taking into account the EPC of common-mode inductor and the ESL of common-mode capacitor and their ESR. The insertion loss formulas are deduced with “A” parameter matrix of two-port network. The simulation and prototypical experiment results are presented to show the effectiveness of the new integrated EMI filter structure and its high-frequency common-mode equivalent circuit model and insertion loss formulas.
杨玉岗, 冯本成, 王长华, 李洪珠. 一种新型的平面无源集成EMI滤波器结构[J]. 电工技术学报, 2012, 27(8): 108-113.
Yang Yugang, Feng Bencheng, Wang Changhua, Li Hongzhu. A Novel Structure of Planar Passive Integrated EMI Filter. Transactions of China Electrotechnical Society, 2012, 27(8): 108-113.
[1] 陈恒林. EMI滤波器高频建模-寄生效应研究[D]. 杭州: 浙江大学, 2007. [2] 和军平, 陈为, 姜建国. 电源线EMI滤波器内部杂散电磁耦合及其作用[J]. 电工技术学报, 2006, 21(10): 12-16. He Junping, Chen Wei, Jiang Jianguo. Stray electromagnetic coupling effect in a power line EMI filter[J]. Transactions of China Electrotechnical Society, 2006, 21(10): 12-16. [3] Wang Shuo. Characterization and cancellation of high-frenquency parasitics for EMI filters and noise separators in power electronics applications[D]. USA: the Virginia Polytechnic Institute and State University, 2005. [4] Zhao Lingyin. Generalized frequency plane model of integrated electromagnetic power passives[D]. USA: the Virginia Polytechnic Institute and State University, 2004. [5] Chen Rengang. Integrated EMI filter for swtich mode power supplies[D]. USA: the Virginia Polytechnic Institute and State University, 2004. [6] Jiang Yan. Three dimensional passive integrated electronic ballast for low wattage HID lamps[D]. USA: the Virginia Polytechnic Institute and State University, 2009. [7] 伍晓峰, 温志伟, 徐德鸿. 基于柔性多层绕组的集成EMI 滤波器[J]. 电源世界, 2009, 4: 26-30. Wu Xiaofeng, Wen Zhiwei, Xu Dehong. Integrated EMI filter based on flexible multi-layer wiring[J]. The World of Power Supply, 2009, 4: 26-30. [8] Wu Xiaofeng, Xu Dehong, Weng Zhiwei, et al. Modeling of integrated EMI filter with flexible multi-layer (FML) foils[C]. Proceedings of the IEEE International Power Electronics and Motion Control Conference, 2009: 749-755. [9] 张艳军. 高功率密度直流变流器及其无源元件集成研究[D]. 杭州: 浙江大学, 2008. [10] 孟进, 马伟明, 张磊, 等. 开关电源变换器传导干扰分析及建模方法[J]. 中国电机工程学报, 2005, 25(5): 49-54. Meng Jin, Ma Weiming, Zhang Lei, et al. Method for analysis and modeling of conducted EMI in switching power converters[J]. Proceedings of the CSEE, 2005, 25(5): 49-54. [11] 穆新华, 杨志勇. 开关电源中印刷电路板寄生参数对传导电磁干扰影响的研究[J]. 中国电机工程学报, 2004, 24(11): 121-125. Mu Xinhua, Yang Zhiyong. Parasitic parameters of circuit traces and their effects on conducted EMI in switching power supply[J]. Proceedings of the CSEE, 2004, 24(11): 121-125. [12] 和军平, 郑宝堂, 王毅. 开关电源近场辐射效应分析与模型研究[J]. 电工电能新技术, 2009, 28(1): 16-20. He Junping, Zhen Baotang, Wang Yi. Near field effect analysis and common mode conducted EMI model of a switched mode power supply[J]. Advanced Technology of E1ectrical Engineering and Energy, 2009, 28(1): 16-20. [13] Liu Qian, Wang Fred Boroyevich Dushan. Frequency- domain EMI noise emission characterization of switching power modules in converter systems[M]. IEEE Press, 2005: 787-792. [14] 董纪清, 陈为, 卢增艺. 开关电源高频变压器电容效应建模与分析[J]. 中国电机工程学报, 2007, 27(31): 121-126. Dong Jiqing, Chen Wei, Lu Zengyi. Modeling and analysis of capacitive effects in high-frequency transformer of SMPS[J]. Proceedings of the CSEE, 2007, 27(31): 121-126. [15] G. S. McMullin, I. W. Hofsajer. Frequency domain modeling of multi-conductor planar integrated passive structures[M]. IEEE Press, 2006: 1611-1616. [16] 祝大同. 环氧-玻纤布基板材料的薄型化技术[J]. 印制电路信息, 2008, 1(1): 12-16. Zhu Datong. Thickness decreasing technology of epoxy, glass fiber laminate materials[J]. Printed Circuit Information, 2008, (1): 12-16.