功率器件结温主动控制及优化策略

doi:10.19595/j.cnki.1000-6753.tces.231234

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Abstract As the core component of the power conversion system, the insulated gate bipolar transistor (IGBT) has been widely used in electric vehicles, aircraft, renewable energy power generation systems, and high-speed railways. Due to the changeable work environment and complex operating conditions, the IGBT module produces a great junction temperature fluctuation during operation, resulting in thermal-mechanical stress in the device. The continuous action of stress will cause degradation of the device, and eventually cause reliability problems of the power conversion system. Studies have shown that power device failures cause more than 30% of power conversion system failures. Moreover, more than 60% of device failures are attributed to the junction temperature fluctuations. Therefore, from the reliability view, the temperature management of power devices has become a significant way to improve the reliability of power conversion systems. The temperature management methods consist of two categories: the dynamic-cooling method and the electrical-parameter method. The dynamic cooling method realizes the temperature control through the active adjustment of the cooling system, and the electrical-parameter method realizes the active configuration of the junction temperature by controlling the parameters related to the device's power loss. However, the current two methods pay more attention to making the device's junction temperature not exceed the safety threshold under full load, while cannot accurately control the junction temperature fluctuation according to the application situation or the demand value. As a result, it is difficult to realize the fine thermal management of the device, which is unfavorable to the application scenario of high reliability. Therefore, an active control strategy of the power device's junction temperature based on finite time boundness theory is proposed in this paper to achieve more accurate control of junction temperature fluctuation. This aim is to reduce the amplitude of junction temperature fluctuation during the operation. Accordingly, the thermal stress caused by the temperature fluctuations decreases. The reliability of power devices is improved by reducing the thermal damage caused by thermal stress. Firstly, the state-space model of the power devices is established based on the Foster thermal network model to achieve real-time estimation of the junction temperature state of devices, and the model parameters are identified based on the finite element analysis method. Secondly, the feedback controller based on the finite time boundness theory for junction temperature management is designed. Considering the junction temperature requirements under different working conditions, the device's switching frequency is selected as the electrical parameter to manage the junction temperature fluctuation and reduce the thermal effect of temperature fluctuations on the device. The simulation and experimental results show that the estimation error of junction temperature by the state-space model is about 2%, and the difference between the junction temperature control result and the set value is about 1.7%, indicating that the proposed method has high precision in estimation and control of junction temperature.

Key words： Power device temperature control reliability thermal management

Received: 14 April 2023

PACS:	TM46
	G521

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	Articles by authors
	Hu Zhen
	Cui Man
	Wu Xiaohua
	Shi Tao

Cite this article:

Hu Zhen,Cui Man,Wu Xiaohua等. Active Control and Optimization Strategy of Junction Temperature for Power Devices[J]. Transactions of China Electrotechnical Society, 2024, 39(18): 5732-5741.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.231234 OR https://dgjsxb.ces-transaction.com/EN/Y2024/V39/I18/5732

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