基于壳温信息的功率器件可靠性分析

doi:10.19595/j.cnki.1000-6753.tces.220886

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Abstract

The solder layer as the heat transfer channel of the power device is sensitive to temperature fluctuations. With the aging process of solder, the heat generated on the chip can not dissipate quickly, causing thermal damage. Real-time evaluation of solder aging is an important guarantee for the reliability of power devices. The thermal impedance from the chip to the substrate can characterize the solder aging, while the junction temperature for estimating the thermal impedance is expensive to obtain. From an economic point of view, this paper proposes a novel method to evaluate solder aging based on the case temperatures. Considering that the case temperature distribution is affected by solder aging, a two-dimensional temperature gradient model based on the case temperatures is built to describe the change of case temperature distribution, and the correlative mechanism between the case temperature distribution and the thermal impedance is studied. Taking solder aging as an intermediate variable, a database containing the 2-D temperature gradient and thermal impedance is established by an offline accelerated aging platform. In practice, the case temperature is measured by a sensor between the substrate and the heat dissipation plate and is used to calculate the 2-D temperature gradient. The reliability of the device is evaluated by identifying the thermal impedance based on the database. In the simulation and experiment analysis, the changing trend of the 2-D temperature gradient and thermal impedance is simultaneous. When the device fails, the 2-D temperature gradient and thermal impedance increase by 16.1%, 20%, and 20.1%, respectively, indicating that the 2-D temperature gradient and thermal impedance are affected by the solder aging in a consistent way. Compared with the existing methods, this method only depending on the case temperature to realize the reliability evaluation of the device is economic.

Key words： Power device solder aging reliability temperature gradient

Received: 19 May 2022

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	Articles by authors
	Cui Man
	Hu Zhen
	Zhang Tengfei
	Zhou Yan
	Jia Rong
	Liu Junjie

Cite this article:

Cui Man,Hu Zhen,Zhang Tengfei等. Reliability Analysis of Power Device Based on the Case Temperatures[J]. Transactions of China Electrotechnical Society, 0, (): 8901-.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.220886 OR https://dgjsxb.ces-transaction.com/EN/Y0/V/I/8901

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