单组分光敏微胶囊/纳米SiO<sub>2</sub>/环氧树脂复合绝缘介质的自修复特性

doi:10.19595/j.cnki.1000-6753.tces.L90358

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Abstract The solid insulating materials represented by epoxy resin inevitably generate local cracks under long-term electrical/mechanical stress, which seriously affects their service life. In this paper, a novel epoxy insulating composite with one-component UV-photosensitive microcapsules is proposed. When the crack is generated and the microcapsule is broken, the damage channel is filled with the photosensitive healing agent and cured by UV excitation. Meanwhile, nano-SiO₂ is introduced into the epoxy matrix as an ultraviolet reflecting agent to protect the healing agent in the microcapsule from the premature polymerization. Properties of microcapsules and composites are tested by optical microscope (OM), scanning electron microscope (SEM), infrared spectrometer, thermogravimetric analyzer and dielectric spectrum analyzer. The results show that the microcapsules are compact and uniform, and have good heat resistance. In addition, the SiO₂ composite matrix has significant UV-shielding effect, which ensures the reactivity of the healing agent from the capsule core. And the composite has an excellent effect on the healing of micro-crack damage while maintaining good intrinsic properties of epoxy resin.

Key words： Epoxy resin self-healing UV-photosensitive microcapsule nano-SiO₂

Received: 10 July 2020

PACS:

TM215.92

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	Articles by authors
	Liang Chen
	Sima Wenxia
	Sun Potao
	Liu Fengqi
	Shao Qianqiu

Cite this article:

Liang Chen,Sima Wenxia,Sun Potao等. Self-Healing Property of One-Component Photosensitive Microcapsule/Nano-SiO₂/Epoxy Composite Dielectric[J]. Transactions of China Electrotechnical Society, 2022, 37(6): 1564-1571.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.L90358 OR https://dgjsxb.ces-transaction.com/EN/Y2022/V37/I6/1564

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