计及铜蒸气介质的小电流直流电弧仿真与实验

doi:10.19595/j.cnki.1000-6753.tces.190552

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Abstract DC arc faults occur frequently due to factors such as insulation degradation and poor contact of cables. The DC arc can not be extinguished naturally because of no zero-crossing current/voltage so that it may cause device damage or fire. It is important to study DC arc properties for the detection of arc faults and safety protection for electrical appliances. Light spectral test data indicate the presence of copper particle in the arc. Therefore, conductivity-temperature characteristic curves of air containing copper vapor medium is proposed based on the equilibrium plasma theory. Meanwhile, a finite element model of small current air DC arc is built, then the temperature field distribution and the relationship between arc resistance and electrode spacing are obtained. By comparing experimental data and the simulation results, we find that the simulation data are much closer to experimental data when copper vapor is considered than that with pure air medium. When the arc burns stably, both the multi-physics field simulation and the experimental test show the similar temperature field distribution along two electrodes, in addition, the maximum gas temperature of plasma reaches 6 000 K~7 500K. The maximum deviation of arc resistance, versus electrode distance, between the simulation and experiment data is 2.283Ω, namely the relative error is 13.45%. Therefore, the arc simulation model considering copper vapor medium is more rational to study the conductivity properties of DC arc. Research work above provides a theoretical basis for electrical characteristics and temperature characteristics of small current DC arcs.

Key words： DC arc copper vapor plasma transport coefficients finite element simulation

Received: 09 May 2019

PACS:

TM501.2

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	Articles by authors
	Zhong Yuming
	Xiong Lan
	Yang Zikang
	Yang Jun
	Guo Ke

Cite this article:

Zhong Yuming,Xiong Lan,Yang Zikang等. Numerical Simulation and Experiment of Small Current DC Arc Considering Copper Vapor Medium[J]. Transactions of China Electrotechnical Society, 2020, 35(13): 2913-2921.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.190552 OR https://dgjsxb.ces-transaction.com/EN/Y2020/V35/I13/2913

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