Effect of Surface Morphology of Direct Bonding Copper Plate on Ultrasonic Wire Bondability
Fang Huachao1, 2, 3, Zheng Libing1, 3, Wang ChunLei1, 2, 3, Han Li1, 3, Fang Guangrong1, 3
1. Institute of Electric Engineering China Acdemay of Sciences Beijing 100190 China; 2. University of China Acdemay of Sciences Beijing 100180 China; 3. Beijing Key Laboratory of Bioelectromagnetism Beijing 100190 China
Abstract DBC(direct bonding copper) plate, as an important part to fulfill electrical connection by using ultrasonic bonding technique in classical power module, has a wide application in high power electronic device module. As a result, the bondability of DBC plate has a vital influence on products’ rate and reliability.
Fang Huachao,Zheng Libing,Wang ChunLei等. Effect of Surface Morphology of Direct Bonding Copper Plate on Ultrasonic Wire Bondability[J]. Transactions of China Electrotechnical Society, 2015, 30(8): 304-310.
[1] 唐勇, 胡安, 陈明. IGBT栅极特性与参数提取[J]. 电工技术学报, 2009, 24(7): 76-80. Tang Yong, Hu An, Chen Ming. IGBT gate charac- teristics and parameter extraction methods[J]. Tran- sactions of China Electrotechnical Society, 2009, 24(7): 76-80. [2] 刘建涛, 王治华, 王珂. 不同结构电压源换流器损耗对比分析[J]. 电力系统保护与控制, 2013, 41(6): 105-110. Liu Jiantao, Wang Zhihua, Wang Ke. Compa rative analysis of losses of voltage source converters with different structures[J]. Power System Protection and Control, 2013, 41(6): 105-110. [3] 苏平, 张靠社. 基于主动式IGBT型Crowbar的双馈风力发电系统LVRT仿真研究[J]. 电力系统保护与控制, 2010(23): 164-171. Su Ping, Zhang Kaoshe. Simulation research for LVRT of DFIG with active IGBT Crowbar[J]. Power System Protection and Control, 2010, (23): 164-171. [4] 米高祥, 陈世锋, 张建兴, 等. 一种大容量智能型能馈式蓄电池放电装置[J]. 电力系统保护与控制, 2010(9): 88-91. Mi Gaoxiang, Chen Shifeng, Zhang Jianxing, et al. Research on an intelligent energy-feedback discharge device for large-capacity storage battery[J]. Power System Protection and Control, 2010(9): 88-91. [5] 郑利兵, 韩立, 刘钧, 等. 基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J]. 电工技术学报, 2011, 26(7): 242-247. Zheng Libing, Han Li, Liu Jun, et al. Inves tigation of the temperature character of IGBT failure mode-Based on 3D thermal-electro coupling FEM[J]. Transactions of China Electrotechnical Society, 2011, 26(7): 242-247. [6] 周雒维, 周生奇, 孙鹏菊. 基于杂散参数辨识的Igbt模块内部缺陷诊断方法[J]. 电工技术学报, 2012, 27(5): 156-163. Zhou Luowei, Zhou Shengqi, Sun Pengju. Diagnostic method for internal defects of IGBTs base on stray parameter identification[J]. Transactions of China Electrotechnical Society, 2012, 27(5): 156-163. [7] 覃荣震, 张泉. 大功率IGBT模块封装中的超声引线键合技术[J]. 大功率变流技术, 2011(2): 22-26. Qin Rongzhen, Zhang Quan. Ultrasonic wire bonding technology in high-power IGBT module assembly[J]. High Power Converter Technology, 2011(2): 22-26. [8] 孙伟. 引线键合技术发展及键合失效机理分析[R]. 2012. [9] Fujimoto K, Nakata S, Manabe T, et al. Effects of bonding conditions and surface state on bondability: Study of Cu wire stitch bonding(1st Report)[J]. Welding International, 1996, 10(9): 705-710. [10] Noolu Narendra J, Lum Ivan, Zhou Y. Roughness enhanced au ball bonding of Cu substrates[J]. IEEE T Compon Pack T, 2006, 29(3): 457-463. [11] 高荣芝, 韩雷. 键合压力对粗铝丝引线键合强度的实验研究[J]. 压电与声光, 2007, 29(3): 366-369. Gao Rongzhi, Han Lei. Experimental studies of bonding pressure on heavy aluminum wire bonding strength[J]. Piezoelect Ect Rics & Acoustooptics, 2007, 29(3): 366-369. [12] 朱正宇, 胡巧声. 半导体封装超声波压焊的工艺参数优化[J]. 电子工业专用设备, 2006(3): 55-60. Zhu Zhengyu, Hu Qiaosheng. Wire bond parameter optimization in semiconductor Assembly[J]. Equip- ment for Electronic Products Manufacturing, 2006(3): 55-60. [13] Ding Yong, Kim JangKyo, Tong Pin. Effects of bonding force on contact pressure and frictional energy in wire bonding[J]. Microelectron Reliab, 2006, 46(7): 1101- 1112. [14] 蒋庄德, 赵卓贤. 形状误差、波度和表面粗糙度划分的谱分析法[J]. 计量学报, 1989, 10(3): 170-175. Jiang Zhuangde, Zhao Zhuoxian. A spectrum analysis method to distinguish form error, waviness and surface roughness[J]. Acta Metrologica Sinica, 1989, 10(3): 170-175.
2015, Vol. 30 
