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| Effect of Surface Morphology of Direct Bonding Copper Plate on Ultrasonic Wire Bondability |
| Fang Huachao1, 2, 3, Zheng Libing1, 3, Wang ChunLei1, 2, 3, Han Li1, 3, Fang Guangrong1, 3 |
1. Institute of Electric Engineering China Acdemay of Sciences Beijing 100190 China;
2. University of China Acdemay of Sciences Beijing 100180 China;
3. Beijing Key Laboratory of Bioelectromagnetism Beijing 100190 China |
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Abstract DBC(direct bonding copper) plate, as an important part to fulfill electrical connection by using ultrasonic bonding technique in classical power module, has a wide application in high power electronic device module. As a result, the bondability of DBC plate has a vital influence on products’ rate and reliability.
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Received: 28 June 2013
Published: 25 May 2015
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2015, Vol. 30 
