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| Anti-Interference Optimization Study of a Hybrid Current Sensor for Silicon Carbide Power Modules under Bonding Wire Failure Conditions |
| Guo Weili1, Xiao Guochun1, Wang Laili1, Liu Ruihuang2, Zhang Chenyu2 |
1. State Key Laboratory of Electrical Insulation and Power Equipment Xi’an Jiaotong University Xi’an 710049 China;
2. Electric Power Research Institute of State Grid Jiangsu Electric Power Co. Ltd Nanjing 211100 China |
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Abstract SiC power modules are extensively utilized in power electronics owingwidely used in power electronics due to their exceptional performance in high-temperature and high-frequency conditions. However, the reliability and stability of these modules can be significantly compromised by bonding wire failures during prolonged operation. Such failures alter the magnetic field distribution around the bonding wires, negatively impacting the accuracy and stability of current measurement by magnetic-field-based sensors. To address this issue Therefore, this study proposes a hybrid current sensor integrating a magnetoresistive sensor and a PCB-based non-encircling Rogowski coil, focusing on optimizing its anti-interference performance under bonding wire failure conditions that integrates a magnetoresistive sensor and a PCB-based non-encircling Rogowski coil, focusing on optimizing its anti-interference performance under conditions of bonding wire failure.
The research begins by systematically analyzing the mutual inductance between the PCB-based Rogowski coil and the bonding wires of a Microsemi SiC power module is analyzed. Given the compact layout and the space limitations imposed by the module’s structure, traditional Rogowski coils are unsuitable. Therefore, a PCB-based non-encircling Rogowski coil design is adopted. The study employs theoretical derivation and finite element simulations to evaluate the impact influence of coil parameters such as turn number, coil spacing, and PCB thickness on mutual inductance and measurement stability, such as turn number, coil spacing, and PCB thickness, on mutual inductance and measurement stability is evaluated through theoretical derivations and finite element simulations. Results indicate that a coil design with 15 turns and a PCB thickness of 1.6 mm achieves optimal balance, maintaining the current gain variation within ±2% even under bonding wire failure scenarios an optimal balance, maintaining current gain variation within ±2% even under conditions of bonding wire failure.
Additionally, the spatial magnetic field distribution near the bonding wires is thoroughly analyzed, considering the conditions of both healthy and faulty bonding wires. The optimal placement for the magnetoresistive sensor is identified at 3~5 mm above the bonding wire centerline of the bonding wire, where the magnetic field intensity and its variation remain minimal during wire failures. The magnetoresistive sensor is strategically placed at the top layer of the PCB to ensure stable performance. The study further validates that even under uneven current redistribution among remaining functional wires, the measurement error remains minimal, demonstrating robust tolerance to non-ideal operating conditions.
Integration of the optimized magnetoresistive sensor and Rogowski coil into a unified hybrid current sensor system is described, detailing the integration of the optimized magnetoresistive sensor and Rogowski coil into a unified hybrid current sensor system is described, detailing a PCB-based design compatible with the SiC module's internal structure. The developed signal processing circuitry combines the strengths of both sensors—precision measurement of DC and low-frequency currents by the magnetoresistive sensor, and high-frequency current detection capabilities of the Rogowski coil—thereby achieving comprehensive coverage from DC to 100 MHz. The frequency response of this hybrid sensor is validated through LTspice simulations and experimental setups, confirming minimal variation in measurement accuracy under bonding wire failure.
Experimental verification is conducted using a Buck converter incorporating the SiC power module. Comparisons between the proposed hybrid sensor and a commercial current sensor confirm the high accuracy and reliability of the hybrid system across various scenarios, under including normal operation and multiple bonding wire failure conditions. Results demonstrate that the hybrid sensor reliably detects fine current fluctuations and maintains accurate measurements despite bonding wire faults, further validating the optimization strategy employed.
In conclusion, this study provides a robust and efficient technical solution for real-time monitoring and reliable current measurement in SiC power modules, particularly addressing the significant challenge of bonding wire failure-induced interference. The proposed hybrid current sensor significantly improves measurement stability and anti-interference capability, offering a promising approach for enhancing enhances measurement stability and anti-interference capability, offering a promising approach to improving the long-term reliability and operational stability of power electronic systems. Future work will aim to further improve sensor integration density strengthen sensor integration density and explore potential applications across a broader range of power electronic modules.
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Received: 03 February 2025
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2025, Vol. 40 
