压接型IGBT器件封装退化监测方法综述

doi:10.19595/j.cnki.1000-6753.tces.201437

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Abstract Press-pack IGBT modules are the basic core modules of large-capacity power electronic equipment in the smart grid. Therefore, their reliability is directly related to operation safety of equipment and power grid. Package failure is the main failure mode of press-pack IGBT modules, and package degradation monitoring is the key to achieve fault diagnosis, state prediction, and intelligent operation and maintenance. The existing research is focusing on the package degradation monitoring of traditional wire-bond IGBT modules. This paper took press-pack IGBT modules as the research object, and firstly introduced the packaging structure of press-pack IGBT modules. Then, seven kinds of package failure modes including fretting wear failure, gate-oxide failure, contact surfaces micro eroding failure, lids warping failure, short-circuit failure, open-circuit failure, and corresponding package degradation monitoring methods were systematically analyzed, and the problems of the existing monitoring methods were proposed. Finally, new ideas for package degradation monitoring of press-pack IGBT modules were proposed from the three aspects of packaging degradation characterization and evaluation, non-contact monitoring, and high-sensitivity monitoring.

Key words： Press-pack IGBT package degradation monitoring failure modes reliability

Received: 01 November 2020

PACS:	TM23
	TM930

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	Li Hui
	Liu Renkuan
	Wang Xiao
	Yao Ran
	Lai Wei

Cite this article:

Li Hui,Liu Renkuan,Wang Xiao等. Review on Package Degradation Monitoring Methods of Press-Pack IGBT Modules[J]. Transactions of China Electrotechnical Society, 2021, 36(12): 2505-2521.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.201437 OR https://dgjsxb.ces-transaction.com/EN/Y2021/V36/I12/2505

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