Analysis and Optimization of Cooling System for 75kVA Three-Level Back-Back Converter
Zhu Yifeng1, 2, 3, Ge Qiongxuan1, Liu Yuhong1, Ren Jinqi
1. Institute of Electrical Engineering of Chinese Academy of Sciences Beijing 100190 China 2. Graduate University of Chinese Academy of Sciences Beijing 100039 China 3. He’nan Polytechnic University Jiaozuo 454003 China
Abstract：For the 75kVA three-level back-to-back converter, the heat sources including the busbar are analyzed and calculated first. Secondly, the equivalent thermal resistance circuit is given. Based on the circuit, a forced-air cooling system is designed for the power converter. After that, a three-dimensional geometric model of the converter is built, and a computation-fluid-dynamics finite element software is used to simulate the cooling system. The impact of the dissipated power of the busbar, power semiconductor devices and the air volume of the cooling fan is also investigated. According to the simulation results, an optimized cooling method through setting up the appropriate aperture opening ratio of the inlets and active wind shields is presented. Finally, some experimental verification is also offered with infrared thermometer in a 75kVA laboratory prototype. Comparing the experimental results with the simulation results, it is shown that the designed cooling system cools the converter well and every power device has almost the same temperature distribution. The provided design methods for the cooling systems may be useful for other power converters.
朱艺锋, 葛琼璇, 刘育红, 任晋旗. 75kVA三电平背靠背变流器的散热分析及优化[J]. 电工技术学报, 2012, 27(2): 103-108.
Zhu Yifeng, Ge Qiongxuan, Liu Yuhong, Ren Jinqi. Analysis and Optimization of Cooling System for 75kVA Three-Level Back-Back Converter. Transactions of China Electrotechnical Society, 2012, 27(2): 103-108.
[1] Chen, Thermal J X. Analysis and design of power electronic parts assembled by heat sink in flyback switching AC DC Converters with Case Enveloped[C]. Proceedings of the 11th IEEE International Conference on Electrical Machines and Systems, Wuhan, China, 2008: 1958-1962. [2] 刘一兵. 功率器件散热技术的研究[J]. 湖南工业大学学报, 2007, 21(4): 77-79. Liu Yibing. Research on heat dissipation technology for power device[J]. Journal of Hunan University of Technology, 2007, 21(4): 77-79. [3] Tewari K, Doss S R, Chen Bin, et al. Electro-thermal design of a heat pipe based high power voltage source converter using emitter turn-off thyristor[C]. Proceedings of the IEEE Industry Applications Conference, Tampa, USA, 2006, 2: 785-790. [4] 胡建辉, 李锦庚. 变频器中的IGBT模块损耗计算及散热系统设计[J]. 电工技术学报, 2009, 24(3): 159-163. Hu Jianhui, Li Jingeng. Losses calculation of IGBT module and heat dissipation system design of inverters[J]. Transactions of China Electrotechnical Society, 2009, 24(3): 159-163. [5] Zambra D A B, Rech C, Goncalves F A S. Power losses analysis and cooling system design of three topologies of multilevel inverters[C]. Proceedings of the 39th IEEE Power Electronics Specialists Conference, Rhodes, Greece, 2008: 4290-4295. [6] 叶斌. 电力电子应用技术[M]. 北京: 清华大学出版社, 2006. [7] Infineon IGBT module FF300R12ME3 datasheet. [8] Siemens Diode power module BYM300A170DN2 datasheet. [9] 王丹, 毛承雄, 范澎, 等. 高压变频器散热系统的设计[J]. 电力电子技术, 2005, 39(2): 115-117. Wang Dan, Mao Chengxiong, Fan Peng, et al. Design of heat sinking in high voltage variable frequency drive system[J].Power Electronics, 2005, 39(2): 115-117. [10] 续明进, 张皓, 董武. 高压变频器散热与通风的设计[J]. 变频器世界, 2005, 9(5): 68-71. Xu Mingjin, Zhang Hao, Dong Wu. Design of ventilation and heat sinking in high voltage inverer[J]. The World of Inverters, 2005, 9(5): 68-71.
2012, Vol. 27 
