Abstract：The heat dissipation system of power electronic device is analyzed based upon a lumped method. The temperature-changing rules during unsteady-state heat conduction are deduced and therefore a method is proposed for charactering system heat dissipation properties by measurement of temperature-changing curves during unsteady-state heat conduction process. Taking the power module as an example, the temperature increasing and decreasing processes are experimentally measured under different conditions. The measurement results agree well with the theoretical prediction, indicating that such a method can be effectively applied in practical engineering applications. The proposed method can not only avoid the complicated computations, but also provide a convenient way for obtaining the heat dissipation properties of power electronic devices and predicting the maximum temperature rise. It is especially applicable to those application cases that the heat dissipation structures are complicated and the heat boundary conditions are difficult to be confirmed.
李洪才, 陈非凡, 董永贵. 功率器件散热特性的非稳态测量方法[J]. 电工技术学报, 2012, 27(2): 114-120.
Li Hongcai, Chen Feifan, Dong Yonggui. An Unsteady-State Measurement Method for Charactering Heat Dissipation Properties of Power Electronic Devices. Transactions of China Electrotechnical Society, 2012, 27(2): 114-120.
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