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| Review on Active Thermal Control Methods Based on Junction Temperature Swing Smooth Control of IGBTs |
| Wei Yunhai, Chen Minyou, Lai Wei, Zhang Jinbao, Hu Yulong |
| State Key Laboratory of Power Transmission Equipment & System Security and New Technology Chongqing University Chongqing 400044 China |
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Abstract Served as core devices in power converters, IGBT devices are used in electric vehicles, rail transit, aerospace, and power systems. However, the junction temperature of IGBT devices swings dramatically due to the harsh operating environment. Hence, under the continuous impact of thermal stress, IGBT devices suffer degradations, which affects the reliability of system operation. At present, domestic and foreign scholars have carried out a lot of research work regarding internal thermal management to extend the operating lifetime. Simultaneously, various active thermal management methods have also been proposed, which are of great significance to delay the aging rate of power devices and improve the reliability of systems. Firstly, this paper clarifies and summarizes the principles and characteristics of the existing methods of active thermal control for IGBTs from the perspective of device level and the system level respectively. Secondly, the effects of the active thermal control methods based on the lifetime evaluation model of IGBTs are evaluated quantitatively. Finally, these methods are comprehensively compared and analyzed from the mitigated degree of the thermal stress, the difficulty of realization, the degree of the lifetime extension and the scope of the application. And the exploration direction of the active thermal control for IGBT devices is prospected, which provides a meaningful reference for the health management of IGBT devices.
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Received: 27 January 2021
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2022, Vol. 37 
